Suction Head Load Control for Electronic Component Handling
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Solution Overview
Problem
Conventional flip chip bonding techniques face challenges in accurately controlling the load on semiconductor chips during suction and release, affecting the precision and reliability of the process.
Innovation Solution
A conveyance device and method that include a suction head with a movement control unit, rotation control unit, and suction control unit, which adjust the suction force based on the rotation position of the suction head to ensure the load on electronic components is equal to or less than a predetermined pressure, accounting for the self-weight of the suction head.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the suction head moves without load correction, then the structure is simple, but the load control accuracy deteriorates due to self-weight variation
Solution Approach 1:
The control unit pre-calculates and applies correction amounts based on the rotation position of the suction head before suction operations. By anticipating the self-weight variation at different rotation positions and adjusting the suction force in advance, the system achieves accurate load control without requiring complex real-time feedback mechanisms during the actual suction process.
Solution Approach 2:
The system creates a computational model of the self-weight variation across different rotation positions and uses this model to generate correction values. Instead of physically measuring the load at each position, the control unit replicates the expected self-weight effects through calculated correction amounts, simplifying the control system while maintaining precision.
2Measurement precision
If the suction force is increased to compensate for self-weight, then the load control accuracy improves, but the electronic component may be damaged due to excessive load
Solution Approach 1:
The correction amount is not applied uniformly but is specifically tailored to each rotation position of the suction head. The control unit adjusts the suction force locally at each position based on the calculated self-weight variation, ensuring that the load on the electronic component remains within safe limits while maintaining accurate control at every stage of the suction process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy of load control during suction and release, improving the precision and reliability of electronic component handling and bonding processes.
Implementation Method 1
a suction head; a movement control unit, moving the suction head; a rotation control unit, controlling a rotation position of the suction head centered on a predetermined rotation shaft; and a suction control unit, causing the suction head to suck or release suction of the electronic component
Data Source
AI summary
This conveyance device comprises: a suction head which suctions and conveys an electronic component; a movement control unit which moves the suction head; a rotation control unit which controls a rotation position of the suction head centered on a predetermined axis of rotation; and a suction control unit which causes the suction head to suction the electronic component such that a load exerted on the electronic component from the suction head in conjunction with the movement of the suction head is less than or equal to a predetermined pressure. The movement control unit sets a correction amount of the predetermined pressure based on the self-weight of the suction head on the basis of the rotation position of the suction head. Using a conveyance device such as the foregoing makes it possible to improve the accuracy of load control during suction or suction release of an electronic component.