Suction Nozzle Soldering for Accurate Through-Hole Component Insertion
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Solution Overview
Problem
Existing methods for attaching leaded components to boards via solder often result in positional deviation due to surface tension and molten solder flow, leading to reduced mounting accuracy and quality.
Innovation Solution
A board work machine with a component mounter and soldering device that uses a suction nozzle to hold and accurately position leaded components, applying molten solder in a controlled manner to prevent positional deviation during and after application, ensuring precise mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If molten solder is applied to leads by flowing towards them, then the leaded component can be attached to the board, but positional deviation occurs during and after solder application
Solution Approach 1:
The suction nozzle holds the leaded component in place before solder application, establishing a fixed reference position. This preliminary positioning action prevents the component from moving during the subsequent soldering process, thereby maintaining mounting accuracy while still achieving reliable attachment.
Solution Approach 2:
The suction nozzle acts as an intermediary between the component placement system and the soldering process. It provides continuous support and positioning during solder application, mediating the conflict between allowing solder flow (for reliable attachment) and preventing positional deviation (for mounting accuracy).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the mounting accuracy of leaded components by maintaining precise positioning during and after solder application, reducing the need for additional fixing mechanisms and enhancing overall board quality.
Implementation Method 1
when a leaded component held by a suction nozzle is moved to a position above a board
Implementation Method 2
due to the surface tension that occurs as the molten solder hardens, there is a tendency for positional deviation of the leaded component to occur
Data Source
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AI summary
Leads 144 of leaded component 140 held by suction nozzle 66 are inserted into through-holes 148 formed in circuit board 12. Then, molten solder 150 is applied to the leads of the leaded component being held by the suction nozzle. Thus, positional deviation of the leaded component during application of the molten solder to the leads is prevented. Also, the leaded component continues to be held by the suction nozzle after application of molten solder to the leads has been completed. Thus, positional deviation of the leaded component while the molten solder hardens is prevented. In this manner, by holding leaded component 140 with a suction nozzle while applying molten solder to leads and while the molten solder is hardening, positional deviation of the leaded component is prevented and the leaded component is mounted with high accuracy.