Suction Unit Grooves Prevent Tape Adhesion
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Solution Overview
Problem
Conventional methods for peeling off protection tapes from semiconductor wafers often result in damage due to the adhesion of peeling tapes with dicing tapes, leading to increased complexity and longer processing times, especially with the need for moving mask plates or lifters.
Innovation Solution
A suction unit with a table having a suction face and grooves along its periphery, where the suction face corresponds to the wafer's plane shape, allowing the dicing tape to sink into the grooves and preventing adhesion with the peeling tape, thus eliminating the need for additional moving parts and simplifying the peeling process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a mask plate is provided to cover the adhesive face side of the dicing tape, then the peeling tape is prevented from adhering to the dicing tape, but the number of parts for moving arrangement increases and the apparatus becomes complicated
Solution Approach 1:
The invention extracts the adhesive sheet from the suction face area by forming grooves that allow the adhesive sheet to protrude outward. This separates the adhesive sheet from the area where peeling tape application occurs, preventing unintended adhesion without requiring a mask plate or other moving protective components.
Solution Approach 2:
The grooves act as an intermediary structure between the suction face and the peeling tape application area. By allowing the adhesive sheet to protrude into the grooves, they create a physical separation that prevents direct contact between the adhesive sheet and peeling tape, serving the protective function without adding complex moving parts.
2Reliability
If a mask plate is moved to cover and retreat positions, then the peeling process can be performed, but the necessary time for peeling process becomes longer
Solution Approach 1:
The grooves are pre-formed in the suction face structure, creating the separation function before the peeling process begins. The adhesive sheet automatically protrudes into the grooves when sucked, establishing the protective configuration in advance without requiring any moving actions during the peeling operation.
3Reliability
If a lifter is used to raise the wafer from the ring frame, then the dicing tape is maintained in an inclined posture to prevent adhesion, but the raising operation causes complication and increase of peeling process time
Solution Approach 1:
Instead of raising the wafer to change the posture of the dicing tape, the invention extracts the adhesive sheet from the horizontal plane by allowing it to protrude into the grooves. This creates a vertical separation that prevents adhesion without requiring any lifting or inclination changes.
4Device complexity
If the suction face area is reduced to accommodate moving components, then the apparatus becomes simpler, but the suction capability is compromised
Solution Approach 1:
The invention resolves the space conflict by utilizing the vertical dimension through grooves. The adhesive sheet protrudes downward into the grooves from the horizontal suction face, creating separation in the vertical direction rather than requiring reduction of the horizontal suction face area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents unintended adhesion between the peeling tape and dicing tape, reducing the number of components and processing time required for peeling, while maintaining the ability to handle wafers of various sizes with enhanced applicability.
Implementation Method 1
a suction unit to hold a plate-like member by sucking an adhesive sheet
Data Source
AI summary
A wafer W is supported on the rear surface side thereof by a ring frame R by means of a dicing tape T, and a protection tape H is stuck on the front surface side the wafer W. A suction unit 12 includes a table 16 having a suction face 15 in the upper face. The suction face 15 sucks the dicing tape T to hold the wafer W through performing a predetermined suction. At least in a partial area along the periphery of the suction face 15, a groove 24 is formed. By sucking through the suction face 15, the inside of the groove 24 becomes negative pressure and the dicing tape T is sunk therein.