Suction Unit with Segmented Solid Immersion Lens for Observation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The existing semiconductor device observation systems face difficulties in easily switching between low-magnification and high-magnification observations due to the integral formation of the analytical plate and solid immersion lens, making it challenging to change over between these observation modes.

Innovation Solution

A suction unit with a main body and a light transmitting portion, featuring first and second suction grooves for vacuum fixing a semiconductor wafer and a solid immersion lens respectively, allowing for easy attachment and detachment of the solid immersion lens while maintaining vacuum fixation of the semiconductor device, along with a semiconductor device observation apparatus and method that incorporates this suction unit for efficient magnification switching.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If the analytical plate and solid immersion lens are integrally formed, then the structural stability is improved, but the ease of operation deteriorates because the entire analytical plate must be fitted and removed to change observation modes

Engineering Contradiction:
Improvestructural stabilityVSAvoidease of operation
Core Design Contradiction:
Stability of the object's compositionVSEase of operation

Solution Approach 1:

The analytical plate is divided into a fixed base plate and a movable lens holder that can be independently attached and detached. The solid immersion lens is mounted on the lens holder, which can be positioned at different locations on the base plate or removed entirely, allowing mode switching without moving the entire analytical plate assembly.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The lens holder is designed with movable and detachable characteristics, transitioning from a static integral structure to a dynamic modular structure. This allows the lens holder to be repositioned or removed based on observation requirements, enabling flexible switching between low-magnification and high-magnification modes while maintaining structural stability of the base plate.

Inventive Principle:
Principle #15Dynamics

2Measurement precision

If the solid immersion lens is always attached to the analytical plate, then the high-magnification observation capability is maintained, but the adaptability deteriorates because low-magnification observation without the lens becomes difficult

Engineering Contradiction:
Improvemeasurement precisionVSAvoidadaptability
Core Design Contradiction:
Measurement precisionVSAdaptability or versatility

Solution Approach 1:

By separating the lens holder from the base plate, the system enables selective attachment of the solid immersion lens. The lens holder can be attached when high-magnification observation is needed and removed or repositioned when low-magnification observation is required, providing adaptability across different observation modes while preserving measurement precision when the lens is attached.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The base plate is designed to support both modes of operation: with the lens holder attached for high-magnification observation and without it for low-magnification observation. This universal design allows the same base plate to accommodate different observation requirements, enhancing system versatility.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of operation

If the analytical plate is removed to detach the solid immersion lens, then the ease of operation improves, but the loss of time increases due to the complex process of fitting and removing the entire analytical plate

Engineering Contradiction:
Improveease of operationVSAvoidloss of time
Core Design Contradiction:
Ease of operationVSLoss of time

Solution Approach 1:

The analytical plate is segmented into a permanent base plate and a removable lens holder. Only the lightweight lens holder needs to be attached or detached for mode switching, not the entire analytical plate assembly. This significantly reduces the time and complexity of operations while maintaining ease of use.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The lens holder is extracted as a separate, independently operable component from the analytical plate. This extraction allows the lens holder to be quickly attached or removed without affecting the base plate, eliminating the time-consuming process of handling the entire analytical plate while preserving operational simplicity.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables seamless switching between low-magnification and high-magnification observations of semiconductor devices, improving observation efficiency and accuracy by allowing easy attachment and detachment of the solid immersion lens without disrupting the vacuum fixation of the semiconductor device.

Implementation Method 1

a first suction groove for vacuum sucking the semiconductor wafer to fix the semiconductor device to the light incident surface

Methodology Applied
Scientific EffectVacuum suction: Vacuum

Implementation Method 2

a second suction groove for vacuum sucking the solid immersion lens to fix the solid immersion lens to the light emitting surface

Methodology Applied
Scientific EffectVacuum suction: Vacuum

Data Source

PatentUS8947776B2Suction apparatus, semiconductor device observation device, and semiconductor device observation method
Publication Date: 2015.02.03 HAMAMATSU PHOTONICS KK
  • US8947776B2 patent drawing
  • US8947776B2 patent drawing
  • US8947776B2 patent drawing

AI summary

A suction unit 10 includes a main body portion having a first surface 13 on which a semiconductor wafer W is arranged and a second surface 14 opposite to the first surface 13, and in which a through-hole 15 that penetrates through the first surface 13 and the second surface 14 is formed and a light transmitting portion having a light incident surface 16 and a light emitting surface 17, and which is fitted to the through-hole 15. Further, in the first surface 13, a first suction groove 13a for vacuum sucking the semiconductor wafer W to fix the semiconductor device D to the light incident surface 16 is formed, and in the second surface 14, a second suction groove 14a for vacuum sucking the solid immersion lens S to fix the solid immersion lens S to the light emitting surface 17 is formed.