Sulfonic Acid-Modified Colloidal Silica for CMP

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Solution Overview

Problem

The existing polishing compositions used in chemical mechanical polishing (CMP) technologies, particularly those containing organic acid-immobilized colloidal silica, face challenges in stability under acidic conditions and residue removal on polished surfaces, leading to suboptimal washability.

Innovation Solution

Sulfonic acid-modified colloidal silica with a specific range of sulfonic acid groups (1.5 μmol/g to 13.0 μmol/g) is developed, enhancing stability and washability by optimizing the amount of sulfonic acid groups per gram of particles, thereby reducing surface residue post-polishing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If organic acid-immobilized colloidal silica is used in polishing composition, then polishing speed is improved, but stability under acidic conditions deteriorates

Engineering Contradiction:

Improvepolishing speedVSAvoidstability under acidic conditions

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent applies parameter changes by precisely controlling the amount of sulfonic acid groups (1.5-13.0 μmol/g) and pH value (2.0-4.0) of the colloidal silica to achieve both high polishing speed and improved stability under acidic conditions. This optimization of chemical parameters resolves the contradiction between productivity and reliability.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If organic acid-immobilized colloidal silica is used in polishing composition, then polishing speed is improved, but washability deteriorates

Engineering Contradiction:

Improvepolishing speedVSAvoidabrasive residue on surface

Core Design Contradiction:

ProductivityVSObject-generated harmful factors

Solution Approach 1:

The patent uses parameter changes by optimizing the sulfonic acid group content (1.5-13.0 μmol/g) and pH (2.0-4.0) to enhance washability while maintaining high polishing speed. This precise parameter control reduces abrasive residue on the polished surface, resolving the contradiction between productivity and harmful factors.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If amount of sulfonic acid groups is increased, then stability under acidic conditions is improved, but washability deteriorates

Engineering Contradiction:

Improvestability under acidic conditionsVSAvoidresidue on polished surface

Core Design Contradiction:

ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The patent applies parameter changes by establishing an optimal range for sulfonic acid groups (1.5-13.0 μmol/g) that simultaneously achieves high stability under acidic conditions and good washability. This balanced parameter optimization resolves the contradiction between reliability and harmful factors.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The sulfonic acid-modified colloidal silica improves stability under acidic conditions and enhances washability, minimizing residue on polished surfaces, making it suitable for use in CMP processes.

Implementation Method 1

sulfonic acid-modified colloidal silica having an amount of sulfonic acid groups per 1 g of particles

Methodology Applied

Scientific EffectChemical bonding: Chemical Bonding

Data Source

PatentUS20230313011A1Sulfonic acid-modified colloidal silica

Publication Date: 2023.10.05 FUJIMI INCORPORATED

AI summary

The present invention provides a means capable of further improving stability and washability under acidic conditions. The present invention is sulfonic acid-modified colloidal silica having an amount of sulfonic acid groups per 1 g of particles of 1.5 μmol/g or more and 13.0 μmol/g or less.