Sulfonium Salt Polymer Resist for Low-LER Patterning

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing chemically amplified resist compositions face issues with acid diffusion leading to line edge roughness (LER) and critical dimension uniformity (CDU) degradation, poor etch resistance, and pattern collapse during miniaturization in semiconductor manufacturing, particularly in ArF excimer laser lithography and electron beam (EB) lithography.

Innovation Solution

A sulfonium salt monomer generating an acid with controlled diffusion and strength, incorporated into a polymer with aromatic sulfonic acid anions, forming a chemically amplified resist composition that enhances etch resistance and solvent solubility, reducing LER and improving pattern resolution.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If acid diffusion is not controlled, then deprotection reaction can occur in unexposed regions, but line edge roughness (LER) and critical dimension uniformity (CDU) are degraded

Engineering Contradiction:
Improvepattern formation reliabilityVSAvoidline edge roughness and critical dimension uniformity
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent introduces a specific sulfonium salt compound as an intermediary substance that mediates between the acid generation and deprotection processes. This compound has a molecular structure designed to control acid diffusion while maintaining effective deprotection in exposed regions, preventing unwanted reactions in unexposed areas and thereby improving both reliability and manufacturing precision

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent modifies the chemical parameters of the acid generator by using a specific sulfonium salt compound with controlled molecular structure. This changes the diffusion characteristics and reactivity parameters of the generated acid, allowing precise control over the deprotection reaction to achieve sharp pattern edges and uniform critical dimensions

Inventive Principle:
Principle #35Parameter changes

2Strength

If polymer with aromatic structure is used for KrF lithography, then high etching resistance is achieved, but strong absorption at 200 nm prevents use in ArF lithography

Engineering Contradiction:
Improveetching resistanceVSAvoidlight absorption at lithography wavelength
Core Design Contradiction:
StrengthVSIllumination intensity

Solution Approach 1:

The patent applies local quality by incorporating aromatic structures with specific local chemical modifications (sulfonium salt groups) that provide etching resistance at needed locations while maintaining overall transparency at the ArF wavelength. The aromatic rings provide structural stability and etch resistance, while the sulfonium groups control the optical and chemical properties locally

Inventive Principle:
Principle #3Local quality

3Productivity

If low activation energy protective groups are used, then high sensitivity resist film is obtained, but deprotection reaction occurs in unexposed regions causing LER and CDU degradation

Engineering Contradiction:
Improveresist sensitivityVSAvoidline edge roughness and critical dimension uniformity
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The sulfonium salt compound acts as an intermediary that bridges the gap between high sensitivity and precision. It enables the use of low activation energy protective groups while controlling the acid diffusion to prevent premature deprotection, thus maintaining both high sensitivity and manufacturing precision

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent changes the reactivity parameters by selecting protective groups with low activation energy while simultaneously controlling the acid generation and diffusion parameters through the sulfonium salt structure. This parameter optimization allows high sensitivity without sacrificing pattern fidelity

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition achieves high contrast, reduced LER, improved etch resistance, and solvent solubility, enabling the formation of small-size patterns with enhanced resolution and stability during development and etching steps.

Implementation Method 1

Upon exposure to high-energy radiation, the acid-decomposable protective group is deprotected by the catalysis of an acid generated from a photoacid generator

Methodology Applied
Scientific EffectPhotolysis: Photodissociation

Implementation Method 2

the acid-decomposable protective group is deprotected by the catalysis of an acid generated from a photoacid generator

Methodology Applied
Scientific EffectAcid catalysis: Catalysis

Implementation Method 3

Since acid diffusion has a significant impact on the sensitivity and resolution of a chemically amplified resist composition, many studies are made on the acid diffusion problem

Methodology Applied
Scientific EffectAcid diffusion: Diffusion

Data Source

PatentUS20250271760A1Sulfonium salt monomer, polymer, chemically amplified positive resist composition, and resist pattern forming process
Publication Date: 2025.08.28 SHIN ETSU CHEMICAL CO LTD
  • US20250271760A1 patent drawing
  • US20250271760A1 patent drawing
  • US20250271760A1 patent drawing

AI summary

A sulfonium salt monomer containing an aromatic sulfonic acid anion having a vinyl-substituted aromatic ring generates an acid having an adequate acid strength and reduced diffusion distance. A chemically amplified positive resist composition comprising a polymer comprising repeat units derived from the monomer exhibits etch resistance and organic solvent solubility.