Sulfur-Containing Dispersing Agent for Low-Temperature Conductive Films
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Solution Overview
Problem
Existing methods for producing conductive films, such as metal vacuum deposition and chemical deposition, are costly and unsuitable for mass production, and the dispersing agents in metal particle dispersion liquids either require high-temperature burning to remove or leave residual organic components, making it difficult to achieve low resistance and stability in conductive films.
Innovation Solution
A metal particle dispersion liquid containing sulfur-containing compounds, such as mercapto-and-ester-group-containing compounds or heterocyclic compounds, which disperse precious metal particles in a medium, allowing for the formation of conductive films at lower temperatures using ultraviolet radiation, ensuring high conductivity and stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a highly stable dispersing agent is used to maintain dispersion, then dispersion stability is improved, but the burning temperature increases and organic components remain in the film
Solution Approach 1:
The patent changes the chemical structure parameters of the dispersing agent by introducing ester groups and controlling the carbon chain length (C1-C8 alkyl groups). This modification allows the dispersing agent to provide sufficient dispersion stability while having lower thermal stability, enabling removal at reduced burning temperatures (150-250°C) and preventing residue in the conductive film.
2Temperature
If a less stable dispersing agent is used to lower burning temperature, then burning temperature is reduced, but dispersion stability deteriorates
Solution Approach 1:
The patent optimizes the molecular structure parameters of the dispersing agent, specifically the balance between the mercapto group (for metal particle binding), ester group (for controlled stability and low-temperature degradation), and alkyl chain length (for steric stabilization). This parameter optimization achieves both sufficient dispersion stability during storage and ease of removal at low burning temperatures.
3Reliability
If conventional metal vacuum deposition is used to produce conductive film, then film quality is improved, but process complexity and cost increase
Solution Approach 1:
The patent replaces the mechanical vacuum deposition system with a chemical solution-based approach. Metal particles are dispersed in a liquid medium containing a dispersing agent, applied to substrates via simple coating methods, and then treated with ultraviolet radiation and low-temperature burning to form conductive films. This substitution eliminates the need for complex vacuum equipment and multi-step processes while achieving comparable film quality.
4Reliability
If conventional chemical deposition is used to produce conductive film, then conductivity is improved, but manufacturing cost and process time increase
Solution Approach 1:
The patent replaces conventional chemical deposition processes with a direct application of pre-formed metal particle dispersion. The metal particles are already in a conductive state and can be directly applied to substrates without requiring complex chemical deposition steps, reducing both process time and manufacturing cost while maintaining conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the production of conductive films with high conductivity and stability at lower temperatures, maintaining dispersion stability and preventing residual organic components, thus overcoming the limitations of existing methods.
Implementation Method 1
a compound having a sulfur atom, metal particles whose diameter ranges from 1 to 100 nm... The metal particles are covered by the compound
Implementation Method 2
can lower a burning temperature to turn the dispersion liquid into a conductive film, such as a wiring and conductive pattern, by using ultraviolet radiation together
Data Source
AI summary
A metal particle dispersion liquid comprises: a compound including a sulfur atom; metal particles whose diameter ranges from 1 to 100 nm and made of a material including a precious metal material; and a dispersion medium. The metal particles is covered by the compound.