Sulfuric Acid Mixing Structure for Sudden-Boiling-Free Substrate Etching
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Solution Overview
Problem
Conventional substrate processing techniques face challenges with sudden boiling reactions when mixing sulfuric acid and moisture-containing liquids, leading to extended processing times and increased chemical consumption, as the mixed solution can boil suddenly upon completion of the etching process.
Innovation Solution
A substrate processing apparatus with a temperature raising part, mixing part, and discharging part, where the mixing part includes a reaction suppression mechanism, such as a U-shaped pipe buffer portion, orifice, gas replacement, cooling part, or sulfuric acid replacement, to prevent sudden boiling by controlling the flow and temperature of the sulfuric acid and moisture-containing liquids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If sulfuric acid and moisture-containing liquid are mixed in a conventional mixing part, then a mixed solution is generated for substrate processing, but sudden boiling reactions occur extending processing time and increasing chemical consumption
Solution Approach 1:
A temperature raising part is introduced as an intermediary component between the sulfuric acid storage and the mixing part. This intermediary raises the temperature of sulfuric acid before it enters the mixing part, preventing sudden boiling reactions when mixed with moisture-containing liquids, thereby reducing processing time and chemical consumption.
2Object-generated harmful factors
If temperature of sulfuric acid is raised before mixing, then sudden boiling is suppressed, but energy consumption increases
Solution Approach 1:
The temperature of sulfuric acid is changed as a parameter before mixing. By raising the temperature of sulfuric acid to a specific range (80-120°C), the mixing reaction with moisture-containing liquids is controlled to prevent sudden boiling, reducing processing time and chemical consumption while managing energy usage efficiently.
3Loss of substance
If conventional mixing methods are used, then equipment complexity is low, but chemical consumption increases due to extended processing time
Solution Approach 1:
The sulfuric acid is pre-heated in the temperature raising part before entering the mixing part. This preliminary action ensures that when the sulfuric acid mixes with moisture-containing liquids, the reaction proceeds controllably without sudden boiling, thereby reducing chemical consumption and processing time despite the added equipment complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively suppresses sudden boiling reactions, reducing processing time and sulfuric acid consumption, allowing for more efficient and controlled etching processes.
Implementation Method 1
a temperature raising part configured to raise a temperature of a first sulfuric acid
Implementation Method 2
a mixing part configured to mix the first sulfuric acid where the temperature is raised by the temperature raising part with a moisture-containing liquid to generate a mixed solution
Implementation Method 3
a discharging part configured to discharge the mixed solution onto a substrate inside a substrate processing part
Data Source
AI summary
A substrate processing apparatus includes: a temperature raising part for raising a temperature of a first sulfuric acid; a mixing part for mixing the first sulfuric acid where the temperature is raised by the temperature raising part with a moisture-containing liquid to generate a mixed solution; and a discharging part for discharging the mixed solution onto a substrate inside a substrate processing part. The mixing part includes: a joining portion where a sulfuric acid supply line through which the first sulfuric acid where the temperature is raised by the temperature raising part flows and a liquid supply line through which the first sulfuric acid where the temperature is raised by the temperature raising part and the moisture-containing liquid flows are joined; and a reaction suppression mechanism for suppressing a reaction between the first sulfuric acid and the moisture-containing liquid in the joining portion.