Super-PIC SPIDER Stacked Photonic Arrays for Wide-FOV Imaging

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Solution Overview

Problem

Conventional electro-optical imaging sensors for high-altitude, long-endurance UAVs and low-cost small satellites face challenges in meeting mass, volume, and power constraints while achieving wide-angle search requirements, with the segmented planar imaging detector for electro-optical reconnaissance (SPIDER) having a limited field-of-view and image size.

Innovation Solution

The implementation of super-photonic integrated circuit (PIC) imaging detector arrays, where multiple PICs are stacked to increase interferometer channels significantly, forming a super-PIC imaging detector array that includes lenslets and waveguides, allowing for a larger field-of-view and image size by uniformly sampling spatial frequencies.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional EO imaging sensors are used, then mass, volume, and power requirements are met, but wide angle search capability and aperture size are severely limited

Engineering Contradiction:
Improvewide angle search capabilityVSAvoidsensor mass
Core Design Contradiction:
Adaptability or versatilityVSWeight of moving object

Solution Approach 1:

The sensor system is divided into multiple independent lenslets arranged in a segmented planar array. Each lenslet independently collects light from different angular directions, enabling wide-angle search capability while keeping individual lenslet mass low. The segmented architecture allows parallel processing of multiple fields of view simultaneously.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent transitions from conventional two-dimensional sensor arrays to a three-dimensional stacked photonic integrated circuit architecture. Multiple PIC layers are stacked vertically, with each layer containing lenslets and waveguide networks. This vertical stacking enables increased aperture equivalent and wide-angle capability without proportionally increasing planar footprint or mass.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Measurement precision

If the number of interferometer channels is increased to improve image size and field-of-view, then SPIDER performance improves, but device complexity and manufacturing difficulty increase

Engineering Contradiction:
Improveimage size and field-of-viewVSAvoidnumber of interferometer channels
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

Multiple interferometer channels are merged onto a single photonic integrated circuit substrate. The PIC integrates multiple lenslets, waveguides, beam combiners, and detectors in a compact planar configuration. This merging approach increases the number of interferometer channels without proportionally increasing overall device complexity, as shared components serve multiple channels.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The photonic integrated circuit is designed with universal components that serve multiple functions across different interferometer channels. Waveguides, beam combiners, and detector arrays are configured to handle multiple spatial frequencies and angular directions simultaneously. This multi-functionality allows a single PIC to replace what would traditionally require multiple separate sensor assemblies.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach results in a substantially reduced size, weight, and power consumption, enabling the SPIDER system to achieve larger images and wider fields-of-view, meeting the performance needs of space situational awareness missions while maintaining affordability.

Implementation Method 1

Each PIC imaging detector array includes a number of lenslets and a number of waveguides. At least some of the lenslets are coupled to multiple waveguides

Methodology Applied
Scientific EffectOptical focusing: Lens

Implementation Method 2

Each PIC imaging detector array includes a number of lenslets and a number of waveguides. At least some of the lenslets are coupled to multiple waveguides

Methodology Applied
Scientific EffectOptical waveguiding: Waveguide (optics)

Implementation Method 3

Sets of two lenslets are configured to form interferometer channels

Methodology Applied
Scientific EffectOptical interference: Interference

Data Source

PatentUS10302409B1Super-PIC SPIDER
Publication Date: 2019.05.28 LOCKHEED MARTIN CORP
  • US10302409B1 patent drawing
  • US10302409B1 patent drawing
  • US10302409B1 patent drawing

AI summary

An apparatus includes a number of photonic integrated circuit (PIC) imaging detector arrays, and multiple electronic integrated circuits (ICs) coupled to the PIC imaging detector arrays. Each PIC imaging detector array of includes a number of lenslets and a number of waveguides. At least some of the lenslets are coupled to multiple waveguides, and sets of two lenslets are configured to form interferometer channels.