Superconducting Chip Bonding Structure for Precise Height Control
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Solution Overview
Problem
Existing methods for connecting superconducting chips face challenges in accurately controlling the height due to the deformation of bumps during melting connections, making precise height control difficult.
Innovation Solution
A structure and manufacturing method involving superconducting materials with the same type of metal electrodes joined via plasma or ion beam activation at low pressure, eliminating the need for bump deformation and allowing precise control of the distance between substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If melting connection using bump is used for electrical connection between superconducting chips, then electrical connection is achieved, but height control becomes difficult due to bump deformation
Solution Approach 1:
The patent replaces the mechanical melting connection process with a direct bonding method using controlled pressure and heat without melting the bump material. The bump maintains its shape while achieving electrical connection through direct bonding between the bump and substrate, eliminating the height control issues caused by melting deformation.
Solution Approach 2:
The patent changes the connection parameters by controlling the bonding temperature and pressure to achieve connection without melting. By maintaining temperature below the melting point and applying controlled pressure, the bump material bonds directly to the substrate while preserving its original shape and height.
2Manufacturing precision
If precise height control is required for capacitive or inductive connection, then connection precision is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The bump structure serves dual purposes: it provides both electrical connection and height control. The controlled height of the unbumped connection structure automatically provides the precise spacing needed for capacitive or inductive coupling, eliminating the need for separate height adjustment mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate height control and superconducting current flow without melting connections, enhancing the precision and reliability of superconducting devices.
Implementation Method 1
a surface activating step of activating surfaces of the first electrode and the second electrode using plasma or ion beams at 1.0×10−4 Pa or lower
Implementation Method 2
a surface activating step of activating surfaces of the first electrode and the second electrode using plasma or ion beams at 1.0×10−4 Pa or lower
Implementation Method 3
a first electrode, a joining surface, and a second electrode joined to the first electrode via the joining surface, wherein the first electrode is formed of the same type of metal as the second electrode
Data Source
AI summary
A structure includes a first substrate, a lower wire formed of a superconducting material and provided on the first substrate, a control post formed of a superconducting material including a metal and provided on the lower wire, an upper wire formed of a superconducting material and provided on the control post, and a second substrate provided on the upper wire. The control post includes a first electrode, a junction surface, and a second electrode, which is joined to the first electrode via the junction surface. The first and second electrodes are formed of the same type of metal.