Superconducting Circuit Oxide Removal and Hermetic Sealing

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Solution Overview

Problem

Superconducting electronic devices, such as quantum computing qubits, suffer from decoherence due to material defects like two-level-systems (TLS) in oxides, which resonate at GHz frequencies, leading to energy dissipation and reduced coherence times, making it challenging to control and manipulate a large number of defects with distributed frequencies.

Innovation Solution

The method involves generating a superconducting electronic circuit on a substrate by removing metal oxides in a substantially oxygen-free environment and enclosing at least a portion of the circuit in a hermetically sealed hollow space to reduce oxide layer thickness and minimize defect interactions, thereby increasing electric field strength without decoherence penalties, allowing for smaller qubit footprints and improved coherence times.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If metal oxides are present on metal surfaces, then native oxide layers form providing surface coverage, but two-level-system defects resonate at GHz frequencies causing energy dissipation and reduced coherence times

Engineering Contradiction:
Improvecoherence timeVSAvoidenergy dissipation
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent removes metal oxides from metal surfaces through chemical etching processes before depositing superconducting layers. This extraction of harmful oxide layers eliminates the two-level-system defects that would otherwise resonate at qubit frequencies and cause energy dissipation, directly improving coherence time without requiring active control mechanisms.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent performs oxide removal and surface preparation in advance, before fabricating the superconducting qubit circuit. By conducting the chemical etching and cleaning processes during the manufacturing stage rather than during operation, the harmful oxide layers are eliminated beforehand, preventing decoherence from the outset and enabling longer coherence times throughout the device lifetime.

Inventive Principle:
Principle #10Preliminary action

2Reliability

If a hermetically sealed hollow space is used to enclose the superconducting circuit, then oxide formation is prevented and coherence is improved, but device structure becomes more complex

Engineering Contradiction:
Improvecoherence timeVSAvoidstructure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent integrates the hermetic seal structure directly into the substrate fabrication process by forming recesses within the substrate itself and sealing them with deposited layers. This merging of the enclosure function into the existing substrate structure avoids adding separate, complex external housing components while still providing effective isolation from oxygen and moisture.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent creates nested structures where superconducting circuits are deposited within recesses of the substrate, which are then sealed by additional deposited layers. This nesting approach embeds the protected circuitry within the substrate structure itself, providing hermetic sealing without requiring external enclosures and maintaining structural compactness.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Reliability

If oxide layer thickness is reduced, then defect density decreases and coherence improves, but manufacturing precision requirements increase

Engineering Contradiction:
Improvecoherence timeVSAvoidoxide removal control
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The patent employs chemical etching processes that selectively remove metal oxides based on chemical reactivity differences between oxides and metals. By controlling etching parameters such as chemical composition, temperature, and exposure time, the process achieves precise oxide thickness control without requiring mechanical precision, as the chemical reaction naturally stops when metal surfaces are exposed.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces mechanical or physical oxide removal methods with chemical etching processes. This substitution allows for more precise and uniform oxide thickness control through chemical reaction kinetics rather than mechanical constraints, achieving better manufacturing precision with simpler process control.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces the occurrence of defects, decreases energy dissipation, and enhances qubit coherence times, enabling more compact and integrated electronic devices with improved performance.

Implementation Method 1

Electronic devices including a superconducting electronic circuit are used in the art in various technical fields. For example, quantum computing devices operating one or a plurality of superconducting quantum bits (qubits)

Methodology Applied
Scientific EffectSuperconductivity: Superconductivity

Data Source

PatentUS20240147871A1Electronic device including a superconducting electronic circuit
Publication Date: 2024.05.02 INFINEON TECH AUSTRIA AG
  • US20240147871A1 patent drawing
  • US20240147871A1 patent drawing
  • US20240147871A1 patent drawing

AI summary

A method of manufacturing an electronic device includes generating a superconducting electronic circuit on a substrate. Metal oxides from metal surfaces of the superconducting electronic circuit are removed in a process chamber with a substantially oxygen-free environment. At least a portion of the superconducting electronic circuit is covered in situ by hermetic encapsulation.