Superconducting Passive Components for Local Cryogenic Temperature Sensing
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Solution Overview
Problem
Existing temperature measurement methods in quantum computing systems are inaccurate due to thermalization issues and the difficulty in integrating precise temperature sensors close to qubits and interposers, leading to false readings and limited resolution.
Innovation Solution
A method using kinetic inductance of superconducting passive components to determine temperature by measuring geometric and total inductance, integrated into a monolayer or multilayer assembly, allowing for precise temperature control in a cryostat, integrating geometric inductance, and geometric in a monolayer or multilayer assembly, allowing for precise temperature control in a cryostat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional temperature measurement methods are used in quantum computing systems, then temperature can be measured, but the measurement accuracy deteriorates due to thermalization issues and heat generation from thermometers
Solution Approach 1:
The patent uses kinetic inductance of superconducting passive components as an intermediary to indirectly measure temperature. Instead of placing thermometers directly near qubits (which causes thermalization issues), the method measures the kinetic inductance of superconducting components whose properties change with temperature, providing an indirect but accurate temperature measurement without introducing harmful thermal effects
Solution Approach 2:
The patent replaces conventional mechanical/thermal temperature sensing methods with an electrical measurement method based on kinetic inductance. By measuring the electrical inductance properties of superconducting components, temperature is determined without physical contact or thermal exchange, eliminating the thermalization problems inherent in conventional thermometer-based approaches
2Measurement precision
If precise temperature sensors are placed close to qubits and interposers, then temperature measurement accuracy improves, but device complexity and integration difficulty increase
Solution Approach 1:
The patent makes the superconducting passive components serve multiple functions: they act as both functional circuit elements (inductors, resonators, transmission lines) and as temperature sensors. This eliminates the need for separate thermometer components, reducing device complexity while maintaining high measurement precision near qubits and interposers
Solution Approach 2:
The patent merges the temperature sensing function with the existing superconducting passive components in the quantum circuit. By combining the sensing capability with the functional components already present in the system, the patent avoids adding separate sensor devices, thereby reducing integration complexity while achieving accurate local temperature measurement
3Measurement precision
If superconducting passive components are used for temperature measurement, then measurement precision improves, but the system must be maintained below critical temperature, limiting operational range
Solution Approach 1:
The patent exploits the change in kinetic inductance parameter of superconducting components as temperature varies. By measuring how the kinetic inductance changes with temperature, the system achieves precise temperature measurement. The method can be adapted to different superconducting materials with different critical temperatures, allowing flexibility in choosing the operational temperature range based on the specific application requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate temperature measurement and control near qubits and interposers, improving the precision and stability of quantum computing systems by utilizing superconducting materials for passive components.
Implementation Method 1
measuring the inductance of the passive component, referred to as total inductance, the passive component being used in a temperature range such that it is in a superconducting state; determining the kinetic inductance of the passive component, based on the total inductance and the geometric inductance; determining the temperature based on the kinetic inductance of the component
Implementation Method 2
to eliminate the Joule effect; to limit thermal transport between the control chip 2 and the quantum chip 1
Data Source
AI summary
A method for determining temperature in the environment of an assembly includes at least one passive component, the passive component being integrated into a monolayer or multilayer assembly, including the following steps: determining the geometric inductance of the passive component, based on the dimensions of the passive component; measuring the inductance of the passive component, referred to as total inductance, the passive component being used in a temperature range such that it is in a superconducting state; determining the kinetic inductance of the passive component, based on the total inductance and the geometric inductance; determining the temperature based on the kinetic inductance of the component.