Superconducting Die Interconnect Assembly With Vacuum Gap Insulation

The patent applies local quality by creating a heterogeneous interconnection structure where superconducting pads (low heat conduction) are interspersed with dielectric pads (high heat blocking) in the same interconnection array. This allows each local region to have optimized properties: superconducting regions provide electrical conduction with minimal heat transfer, while dielectric regions provide thermal insulation. The local alternation of conductive and insulating pads resolves the contradiction between achieving high integration density through small pitch and maintaining thermal insulation.

The patent segments the bonding interface into functionally distinct superconducting pads and dielectric pads that are bonded face-to-face. This segmentation allows the bonding process to remain simple and direct (improving ease of manufacture) while the dielectric pad segments provide thermal blocking pathways (reducing heat transfer). The segmented structure resolves the contradiction by spatially separating thermal and electrical functions within the same bonding interface.

The patent merges the electrical interconnection function and thermal insulation function into a single integrated pad structure. Each pad location can be either superconducting (for electrical connection) or dielectric (for thermal insulation), and both functions are achieved through the same bonding process without requiring separate insulation layers or complex multi-layer structures. This merging reduces device complexity while maintaining effective thermal insulation.