Exfoliated Superconducting Filaments for Lower Magnetization Loss
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current high-temperature superconducting wires face issues such as high magnetization losses, non-uniform conductor heating leading to delamination, poor mechanical properties, and labor-intensive splicing requirements, limiting their application in magnets and power transmission.
Innovation Solution
The method involves exfoliating the superconducting layer from the metal substrate to create a tape that is then coated with a protective layer and encapsulated with a conductive material, allowing for uniform electrical properties and enhanced mechanical strength, enabling the formation of continuous filaments and cables with reduced magnetization losses and improved splicing capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a high-aspect ratio tape architecture is used, then the superconducting layer can be manufactured with record high upper critical field and critical temperature, but the magnetization (AC) losses increase significantly
Solution Approach 1:
The patent divides the superconducting tape into multiple thin superconducting layers separated by stabilizing layers. This segmentation reduces the aspect ratio of each individual superconducting layer, thereby reducing magnetization losses while maintaining the high critical temperature properties through the layered architecture.
Solution Approach 2:
The patent transitions from a single thick superconducting layer to a multi-layered structure with stabilizing layers interspersed between superconducting layers. This dimensional change in the structure allows current to flow through multiple parallel paths, reducing the effective aspect ratio and magnetization losses while preserving high-temperature superconducting properties.
2Manufacturing precision
If the superconducting layer is deposited on an insulating oxide buffer, then the superconducting layer can be grown with proper orientation, but the bottom surface of the superconducting layer lacks good electrical pathway to the exterior
Solution Approach 1:
The patent introduces a conductive stabilizing layer as an intermediary between the insulating oxide buffer and the superconducting layer. This stabilizing layer provides the necessary electrical pathway from the bottom surface of the superconducting layer to the exterior, while the oxide buffer maintains its function of providing proper crystal orientation during deposition.
Solution Approach 2:
The patent creates a composite structure combining the insulating oxide buffer layer (for orientation control), the conductive stabilizing layer (for electrical pathways), and the superconducting layer. This composite architecture resolves the contradiction by allowing each layer to fulfill its specific function without interfering with the others.
3Ease of manufacture
If the stabilizing layer is positioned only at the top surface, then the manufacturing process is simplified, but the conductor heating during quench becomes non-uniform causing de-lamination
Solution Approach 1:
The patent segments the stabilizing function by placing stabilizing layers at both the top and bottom surfaces of the superconducting layer, rather than only at the top. This symmetric segmentation ensures uniform heat dissipation during quench events, preventing de-lamination while maintaining manufacturing feasibility through standardized deposition processes.
Solution Approach 2:
The patent addresses the asymmetric heating problem by introducing symmetry into the stabilizing layer configuration. By placing identical stabilizing layers at both top and bottom surfaces, the structure achieves symmetric thermal management, preventing the non-uniform heating that causes de-lamination in asymmetric designs.
4Loss of energy
If the superconducting layer is separated from the substrate, then the aspect ratio is reduced and magnetization losses decrease, but additional processing steps are required
Solution Approach 1:
The patent incorporates the stabilizing layer during the initial deposition process on the substrate, before the superconducting layer is fully formed. This preliminary action integrates the separation function into the manufacturing process itself, reducing the need for additional post-processing steps while achieving the desired low-aspect-ratio structure.
Solution Approach 2:
The patent merges the stabilizing layer deposition with the superconducting layer formation process. By combining these functions into a single integrated manufacturing process, the patent reduces the number of separate processing steps required, making the separation of superconducting layers from substrate more efficient despite the added structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in high-temperature superconducting filaments and cables with reduced delamination risk, enhanced mechanical properties, and lower magnetization losses, facilitating the use in high-field magnets and power transmission with improved efficiency and reduced splicing complexity.
Implementation Method 1
separating the superconducting layer from the metal substrate
Implementation Method 2
coated with a protective layer
Implementation Method 3
galvanically electroplating a conductive metal (e.g., copper) thereabout
Implementation Method 4
the exfoliation is accomplished by rapidly heating the substrate with an inductive coil
Data Source
Figure 1~2
Figure 3~6
Figure 7~8
AI summary
A high-temperature superconducting filament and cable, and a method for manufacturing same. The substrate used to grow the superconducting layer is removed, and the exfoliated superconducting layer is coated with a protective layer, and then sliced into narrow strips. The strips are thereafter encapsulated with a conductive metal to provide a high-temperature superconducting filament. The filaments may be bundled together to provide a high-temperature superconducting cable.