Superconducting Frequency Multiplexing for Low-Heat Signal Transfer
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Solution Overview
Problem
The lack of high-density memory in superconducting computing systems and the challenge of transmitting encoded logical bit information between superconducting and semiconductor domains, along with thermal radiation issues from power dissipation, hinder the performance of hybrid computing systems.
Innovation Solution
A superconducting circuit generates frequency multiplexed AC signals encoding logical bit values, which are demultiplexed and decoded in the higher-temperature domain, reducing thermal conductivity and using fewer metallic interconnections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple logical bit signals are transmitted through separate metallic interconnections between superconducting and semiconductor domains, then signal transmission reliability is improved, but thermal conductivity increases and thermal heating worsens
Solution Approach 1:
Multiple logical bit signals are merged into a single multiplexed signal by encoding them onto different frequency carriers. This consolidation reduces the number of metallic interconnections from multiple separate lines to a single transmission line, thereby reducing thermal conductivity and thermal heating while maintaining signal transmission reliability through frequency division multiplexing
Solution Approach 2:
The transmission system transitions from spatial multiplexing (multiple parallel interconnections) to frequency multiplexing (another dimension). By encoding multiple logical bits onto different frequency carriers within a single transmission line, the system achieves high-dimensional signal representation that reduces physical interconnection requirements and associated thermal issues
2Adaptability or versatility
If multiple metallic interconnections are used to transmit logical bit information, then communication capability between domains is improved, but device complexity increases
Solution Approach 1:
Multiple communication channels are merged into a single multiplexed transmission line by combining multiple logical bit signals onto different frequency carriers. This reduces the number of interconnections from multiple separate lines to one, simplifying the device architecture while maintaining full communication capability through frequency-division multiplexing
Solution Approach 2:
A single transmission line is designed to perform multiple functions by carrying multiple frequency-multiplexed signals simultaneously. This universal interconnection replaces multiple dedicated lines, reducing device complexity while maintaining adaptability and versatility of the communication interface between superconducting and semiconductor domains
3Temperature
If frequency multiplexed signals are transmitted through a single output line, then thermal conductivity is reduced and thermal heating is minimized, but signal transmission complexity increases
Solution Approach 1:
The system replaces physical separation of multiple transmission lines with electromagnetic frequency multiplexing. Instead of using multiple separate mechanical interconnections, the invention encodes multiple logical bit signals onto different frequency carriers within a single transmission line, reducing thermal conductivity while managing complexity through electronic frequency management rather than physical multiplication of interconnections
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves high throughput and low latency in hybrid computing systems by minimizing thermal heating and maintaining the cold temperatures needed in the superconducting domain, enabling efficient communication between superconducting and semiconductor domains.
Implementation Method 1
The oscillator stage comprises a direct current superconducting quantum interference device (DC SQUID)
Implementation Method 2
maintaining the cold temperatures needed in the superconducting domain
Data Source
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AI summary
A circuit configured to transmit frequency multiplexed signals (208) from a superconducting domain (201) to a higher temperature domain (202). The circuit comprising a multiplexed signal output (208) and a plurality of superconducting oscillator circuits (204) each configured to output a different carrier frequency, each superconducting oscillator circuit comprising an oscillator output connected to the multiplexed signal output. Each superconducting oscillator circuit comprising a converter stage configured to convert an input (206) of a superconducting logic signal to a Single Flux Quantum (SFQ) bit value, a splitter stage electrically connected to an output of the converter stage, the splitter stage configured to change between a first current state and a second current state based at least in part on the SFQ bit value, and an oscillator stage magnetically coupled to an output of the splitter stage and electrically coupled to the oscillator output. The oscillator stage comprising a direct current superconducting quantum interference device (DC SQUID).