Superconducting Interconnect Cooling via Segmented Cryogenic Zones
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Solution Overview
Problem
Traditional semiconductor-based integrated circuits face limitations in device size, switching frequency, and power consumption, particularly due to leakage currents, and superconducting logic devices require expensive and energy-intensive cooling methods to operate effectively.
Innovation Solution
The use of flexible multiconductor microstrip or stripline ribbon cables cooled by low-temperature gas or liquid, such as helium, enclosed in a conduit, along with heat pipes or thermally conductive straps to cool superconducting interconnects to cryogenic temperatures, reducing signal attenuation without additional energy expenditure on cooling the logic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If superconducting logic devices are cooled to cryogenic temperatures, then signal transmission performance is improved, but energy consumption and cost increase
Solution Approach 1:
The patent divides the cooling system into separate zones: a first cooling zone for logic devices and a second cooling zone for interconnect cables. This segmentation allows each component to be cooled to the minimum necessary temperature, improving signal transmission while reducing overall energy consumption compared to cooling the entire system uniformly.
Solution Approach 2:
The patent applies different cooling temperatures to different parts of the system. The interconnect cables are cooled to a lower temperature than the logic devices when signal attenuation is high, while logic devices operate at a higher temperature. This local quality approach optimizes signal transmission in critical areas without unnecessarily cooling non-critical components.
2Reliability
If interconnect cables are cooled to lower temperatures, then signal attenuation is reduced, but cooling system complexity increases
Solution Approach 1:
The patent designs a dual-purpose cooling apparatus that can function as a heat sink for logic devices and as an active cooling system for interconnect cables. The same thermal management structure serves multiple functions: maintaining logic devices at operating temperature and selectively cooling cable sections to reduce signal attenuation, thereby reducing overall system complexity.
Solution Approach 2:
The patent introduces thermal interface materials and thermally conductive structures as intermediaries between the cooling apparatus and the interconnect cables. These intermediaries efficiently transfer heat from the cables to the cooling apparatus, enabling effective thermal management without requiring direct mechanical coupling or complex cooling infrastructure.
3Use of energy by moving object
If logic devices are cooled to higher temperatures, then energy consumption decreases, but signal transmission quality deteriorates
Solution Approach 1:
The patent segments the thermal management into distinct zones with different temperature requirements. Logic devices operate in a first cooling zone at higher temperatures that consume less energy, while interconnect cables are cooled in a second zone at lower temperatures to maintain signal transmission quality. This segmentation resolves the contradiction by allowing each component to operate at its optimal temperature.
Solution Approach 2:
The patent applies different thermal conditions to different parts of the system based on their specific requirements. Logic devices are maintained at higher temperatures for energy efficiency, while only the critical interconnect cable sections are cooled to lower temperatures to preserve signal transmission quality. This local quality approach optimizes the trade-off between energy consumption and signal quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach achieves significant energy savings by cooling only the superconducting signal lines to a lower temperature than the logic devices, thereby reducing signal attenuation and maintaining high-frequency signal integrity over long distances with minimal loss.
Implementation Method 1
coolant to chill the superconducting interconnect to a lower temperature than the logic devices
Implementation Method 2
Joule-Thomson valve adapted to accept a gas coolant provided at a first temperature and a first pressure, and provide the gas coolant to an interior portion of the conduit at a lower pressure than the first pressure and at a second temperature lower than the first temperature
Implementation Method 3
superconducting signal lines on the interconnect to a second, lower operating temperature than the first operating temperature of the at least two sets of superconducting logic devices
Data Source
Figure 1
Figure 2
Figure 3A~3C
AI summary
Methods and apparatus are disclosed for cooling superconducting signal lines disposed on an interconnect such as a flexible cable or a rigid substrate. The superconducting signal lines are cooled to a cryogenic temperature lower than the temperature at which at least some superconducting logic devices coupled to the interconnect are operated. In some examples, an airtight conduit, heat pipe, or thermally conduct of strap provided to cool the superconducting interconnect. In one example of the disclosed technology, a system includes at least two sets of superconducting logic devices, cooling apparatus adapted to cool the logic devices to a first operating temperature, and interconnect coupling the superconducting logic devices, and a cooling apparatus in thermal communication with the interconnect. The apparatus is adapted to cool superconducting signal lines on the interconnect to a lower operating temperature than the first operating temperature at which the superconducting logic devices operate.