Superconducting Interposer for Virtual-Photon Quantum Error Correction
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Solution Overview
Problem
As the number of qubits on a quantum processor increases, existing planar structures for transmitting quantum information between separate qubits are inadequate for effective quantum error correction, particularly due to susceptibility to environmental noise and the Purcell effect.
Innovation Solution
A system utilizing a superconducting interposer with dielectric material and superconducting structures to transmit quantum information between ancilla and data qubits via virtual photons, allowing for error mapping and correction while minimizing environmental interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If planar structures such as bus resonators are used to transmit quantum information between qubits on separate chips, then the transmission can be achieved, but the transmission is prone to errors due to real photon transfer and dielectric loss
Solution Approach 1:
The patent introduces a superconducting interposer as an intermediary component between the data qubit chip and ancilla qubit chip. This interposer contains superconducting structures that enable quantum information transmission through virtual photons rather than real photons, thereby reducing the harmful effects of dielectric loss and Purcell effect while maintaining transmission reliability for quantum error correction
Solution Approach 2:
The patent changes the transmission mechanism from real photons to virtual photons by utilizing the superconducting interposer. This parameter change in the photon type fundamentally alters the transmission characteristics, reducing error susceptibility while maintaining the ability to transmit quantum information between separate qubit chips
2Reliability
If qubits are separated onto different chips to enable quantum error correction, then error correction capability is improved, but the complexity of transmitting quantum information between chips increases
Solution Approach 1:
The patent segments the quantum processor into separate data qubit chip and ancilla qubit chip, each optimized for specific functions. The superconducting interposer acts as a dedicated transmission bridge between these segmented components, enabling quantum error correction while managing the complexity through modular architecture
Solution Approach 2:
The superconducting interposer serves as a specialized intermediary that simplifies the transmission between separated chips. By using superconducting structures with virtual photon transmission, it reduces the complexity compared to traditional planar bus resonator approaches, enabling reliable quantum information transfer between the segmented qubit chips
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient quantum error correction by reducing coupling between data and environmental noise, preserving quantum information coherence, and allowing for fast measurement of ancilla qubits without compromising data qubit stability.
Implementation Method 1
The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction
Implementation Method 2
an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material
Data Source
AI summary
A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.