Superconducting Interposer for Low-Loss Quantum Information Transfer
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Solution Overview
Problem
Current quantum computing technologies face challenges in efficiently transmitting quantum information between qubits on separate chips, particularly for quantum error correction, as existing planar structures are susceptible to electromagnetic interference and environmental noise, leading to loss of quantum information.
Innovation Solution
A superconducting interposer with dielectric material and superconducting structures is used to transmit quantum information between ancilla and data qubits, employing virtual photon transfer to prevent real photon loss and maintain quantum coherence, allowing for separate fabrication and tuning of qubits based on their specific requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If planar structures such as bus resonators are used to transmit quantum information between qubits on separate chips, then the transmission can be achieved with simple structure, but the system is susceptible to electromagnetic interference and environmental noise leading to loss of quantum information
Solution Approach 1:
The patent introduces a three-dimensional superconducting transmission line structure as an intermediary medium between qubits on separate chips. This superconducting transmission line acts as a mediator that enables quantum information transfer while providing shielding against electromagnetic interference and environmental noise, thus resolving the contradiction between structural simplicity and quantum information integrity.
Solution Approach 2:
The patent employs composite structures combining superconducting materials with three-dimensional geometries to create transmission lines that simultaneously achieve low loss and electromagnetic shielding. The composite nature of the superconducting transmission line provides both the simplicity needed for fabrication and the reliability required for quantum information protection.
2Quantity of substance
If qubits are fabricated on separate chips to increase the number of qubits, then the quantum processor capacity increases, but the transmission of quantum information between chips becomes more complex and loss-prone
Solution Approach 1:
The patent transitions from planar two-dimensional transmission structures to three-dimensional superconducting transmission lines. This dimensional change enables quantum information to be transmitted between chips with reduced susceptibility to electromagnetic interference and environmental noise, thereby reducing quantum information loss while supporting increased qubit quantities on separate chips.
3Productivity
If fast measurements are performed on ancilla qubits for quantum error correction, then the error correction speed increases, but the coherence time of data qubits may be reduced due to repeated interactions
Solution Approach 1:
The patent separates ancilla qubits and data qubits onto different chips, with the ancilla qubits on one chip and data qubits on another chip connected via superconducting transmission lines. This spatial segmentation allows fast measurements on ancilla qubits without direct repeated interactions with data qubits, thereby maintaining data qubit coherence times while enabling rapid error correction cycles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables robust quantum error correction by preserving quantum information integrity and extending qubit lifetimes, facilitating fast measurements on ancilla qubits while maintaining long coherence times for data qubits, thus enhancing the reliability of quantum computing systems.
Implementation Method 1
employing virtual photon transfer to prevent real photon loss and maintain quantum coherence
Implementation Method 2
A superconducting interposer with dielectric material and superconducting structures is used to transmit quantum information
Data Source
Figure 1
Figure 2A~2B
Figure 2C~2D
AI summary
A system for transmission of quantum information for quantum error correction includes an ancilla qubit chip including a plurality of ancilla qubits, and a data qubit chip spaced apart from the ancilla qubit chip, the data qubit chip including a plurality of data qubits. The system includes an interposer coupled to the ancilla qubit chip and the data qubit chip, the interposer including a dielectric material and a plurality of superconducting structures formed in the dielectric material. The superconducting structures enable transmission of quantum information between the plurality of data qubits on the data qubit chip and the plurality of ancilla qubits on the ancilla qubit chip via virtual photons for quantum error correction.