Superconducting PCB and Chip Assembly for Cryogenic I/O Density
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Solution Overview
Problem
The assembly of superconducting processors is complex due to increased input/output lines, requiring larger physical space, higher power consumption, and increased failure probability during cool-down, especially in cryogenic environments.
Innovation Solution
A system comprising a superconducting printed circuit board, input/output chip, and processor chip, bonded through a plurality of contacts such as Indium bump bonds or superconducting solder bonds, with shield and thermally conductive layers to manage magnetic flux and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional non-superconducting electronics are used in PCBs, then power consumption and heat dissipation are managed, but assembly complexity increases and reliability decreases in cryogenic environments
Solution Approach 1:
The patent changes the fundamental operating parameter of the electronics from conventional temperatures to cryogenic temperatures, enabling superconducting operation. This parameter change allows the system to achieve zero electrical resistance and eliminate heat dissipation issues, while also reducing assembly complexity through specialized superconducting PCB designs that integrate all components for simultaneous cooling.
Solution Approach 2:
The patent employs composite material structures including superconducting layers, normal conducting layers, and insulating layers in the PCB construction. This multi-layer composite approach allows integration of both superconducting and non-superconducting components while maintaining structural integrity and enabling effective thermal management in cryogenic environments.
2Adaptability or versatility
If the number of input/output lines is increased, then processor functionality is enhanced, but physical space requirements and failure probability increase
Solution Approach 1:
The patent segments the processor system into modular components including processor chips, I/O chips, and PCB modules that can be independently assembled and tested. This segmentation allows for reduced failure probability by isolating potential failure points and enabling targeted replacement without affecting the entire system, while still providing enhanced functionality through modular expansion.
Solution Approach 2:
The patent implements a nested structure where processor chips are mounted on PCBs, which are then integrated into larger processor systems with multiple layers of interconnection. This nesting approach efficiently manages the increased number of I/O lines by organizing them in hierarchical structures, reducing physical space requirements while maintaining high functionality.
3Loss of energy
If superconducting technology is implemented, then heat dissipation is reduced, but manufacturing and assembly become more complex
Solution Approach 1:
The patent applies preliminary action by pre-cooling the entire processor system to cryogenic temperatures before operation and by pre-assembling superconducting components in controlled environments. This approach simplifies manufacturing and assembly by ensuring that all components are in their superconducting state during integration, eliminating the need for complex post-assembly cooling procedures and reducing manufacturing complexity.
4Adaptability or versatility
If processor size is increased to accommodate more I/O lines, then functionality is enhanced, but physical space requirements and assembly complexity increase
Solution Approach 1:
The patent transitions from two-dimensional PCB layouts to three-dimensional processor architectures with multiple stacked layers of I/O lines and interconnects. This dimensional change allows for enhanced I/O capability without proportionally increasing the physical footprint, as additional I/O lines are accommodated in vertical spaces between layers rather than requiring additional horizontal space.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces assembly complexity, minimizes physical space requirements, and enhances reliability by mitigating magnetic flux and thermal management, thereby improving processor performance and reducing deployment delays.
Implementation Method 1
Superconducting technology can offer many advantages over conventional, non-superconducting electronics. Superconductors operate in a regime of little to no electrical resistance, and therefore do not generate heat to the same extent as conventional non-superconducting devices.
Implementation Method 2
The plurality of contacts of the processor chip, the plurality of contacts of the printed circuit board and the first and the second plurality of contacts of the I/O chip may be at least one of: Indium bump bonds and superconducting solder bonds.
Data Source
AI summary
This disclosure generally relates to processor systems comprising printed circuit boards, I/O chips and processor chips with mated contacts. Contacts are formed on an upper surface of a printed circuit board having a through-hole and on a processor chip inside the through-hole. The processor chip may be a superconducting quantum processor chip comprising qubits, couplers, Digital to Analog converters, QFP shift registers and analog lines. Contacts are formed on an upper surface on an I/O chip and mated with the contacts on the printed circuit board and the processor chip. Contacts may be Indium bump bonds or superconducting solder bonds. The processor chip and the I/O chip may include a shield layer, a substrate layer and a thermally conductive layer.