Superconducting Tape Substrate with Etched Undercut Volumes
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Solution Overview
Problem
Existing methods for reducing AC losses in superconducting tapes are not adaptable to continuous processing of long lengths and are not cost-effective, nor do they provide an improved substrate for superconducting tapes.
Innovation Solution
A method involving a layered solid element with a nickel-based alloy lower layer and a gas-hardened upper layer, where disruptive strips are formed and undercut volumes are created through etching, allowing for the efficient separation of superconducting material into striated lines, enabling reduced AC losses and scalable manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If segmented superconducting structures are used to reduce AC losses, then AC losses are reduced, but the processing complexity and manufacturing difficulty increase for long lengths
Solution Approach 1:
The superconducting layer is segmented into multiple parallel strips by forming disruptive strips in the substrate and buffer layer, creating discontinuities that separate current-carrying elements. This segmentation reduces AC losses by preventing circulating currents while maintaining DC superconductivity.
Solution Approach 2:
Disruptive strips are formed in the substrate and buffer layer before depositing the superconducting layer. This preliminary action creates the segmented structure in advance, allowing continuous processing of long tape lengths without requiring post-processing segmentation steps.
2Loss of energy
If conventional segmentation methods are used, then AC losses are reduced, but adaptability to continuous processing of long lengths is poor
Solution Approach 1:
The disruptive strips are formed in the substrate and buffer layer before superconducting layer deposition, enabling the segmented structure to be created during continuous tape manufacturing processes. This approach is adaptable to long length production as it does not require complex post-processing steps.
Solution Approach 2:
The method enables continuous processing by forming disruptive strips in a manner compatible with continuous tape manufacturing. The substrate and buffer layer are prepared with disruptive strips, then the superconducting layer is deposited continuously over the entire length, maintaining production efficiency while achieving segmentation.
3Loss of energy
If complex segmentation structures are implemented, then AC losses are reduced, but material consumption and manufacturing cost increase
Solution Approach 1:
The segmentation is achieved by forming narrow disruptive strips in the substrate and buffer layer rather than using wide separators or complex multi-layer structures. This minimizes the amount of non-superconducting material while still achieving effective current path separation for AC loss reduction.
Solution Approach 2:
The disruptive strips are formed only in specific locations where current path separation is needed, rather than using uniform thick separators across the entire tape width. This localized approach reduces material consumption while maintaining AC loss reduction effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively reduces AC losses in superconducting tapes by physically separating superconducting material, facilitating continuous processing and large-scale manufacturing while minimizing material costs.
Implementation Method 1
forming, such as forming in a deformation process, a plurality of disruptive strips in the upper layer
Implementation Method 2
Etching the exposed areas so as to form undercut volumes between the upper layer and the lower layer
Data Source
AI summary
There is provided a method for producing a substrate (600) suitable for supporting an elongated superconducting element, wherein, e.g., a deformation process is utilized in order to form disruptive strips in a layered solid element, and where etching is used to form undercut volumes (330, 332) between an upper layer (316) and a lower layer (303) of the layered solid element. Such relatively simple steps enable providing a substrate which may be turned into a superconducting structure, such as a superconducting tape, having reduced AC losses, since the undercut volumes (330, 332) may be useful for separating layers of material. In a further embodiment, there is placed a superconducting layer on top of the upper layer (316) and/or lower layer (303), so as to provide a superconducting structure with reduced AC losses.