Superconducting Wire Substrate R-Face Design
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Solution Overview
Problem
Existing superconducting wire manufacturing methods face challenges in forming reliable superconducting layers on side faces of substrates due to uneven layering and weak adhesion at corner portions, leading to exfoliation issues.
Innovation Solution
A superconducting film-forming substrate with a tape shape featuring a spreading face on its side faces, which extends outward from the edge of the film-forming face to the rear face, and a surface roughness greater than the film-forming face, along with a metallic layer covering the side faces for enhanced malleability, to facilitate even layer formation and prevent exfoliation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the side face of the substrate is made perpendicular to the film-forming face, then the substrate structure is simple and easy to manufacture, but it is difficult to form a film on the side face and the layering becomes uneven
Solution Approach 1:
The side face of the substrate is designed with a curved surface (R face) that spreads outward in a round shape from the edge part of the rear side toward the edge part of the film-forming face. This curvature allows the film-forming apparatus to deposit superconducting layers uniformly on the side face, eliminating the uneven layering problem that would occur with a perpendicular side face.
2Device complexity
If there is a corner portion between the film-forming face and the side face, then the substrate structure is simple, but the adhesion at the corner portion becomes weak and exfoliation occurs
Solution Approach 1:
The substrate structure is modified to eliminate the sharp corner portion between the film-forming face and side face. Instead, an R face is formed that creates a gradual transition zone, distributing the stress and improving adhesion. Additionally, intermediate layers are extended to cover the R face area, ensuring continuous coverage and preventing exfoliation at what would have been the corner portion.
3Ease of manufacture
If the side face is made perpendicular to the film-forming face, then the substrate manufacturing is easier, but the intermediate layers and superconducting layers exfoliate
Solution Approach 1:
The R face with curved surface allows intermediate layers and superconducting layers to be deposited continuously from the film-forming face onto the side face without sharp transitions. This curved geometry ensures that the layered structure maintains its integrity and prevents exfoliation, while still being manufacturable through standard forming processes.
Data Source
AI summary
A tape-shaped superconducting film-forming substrate is disclosed, which includes a film-forming face for forming a laminate including a superconducting layer thereon, a rear face that is a face at a side opposite to the film-forming face, a pair of end faces connected to the film-forming face and the rear face, and a pair of side faces connected to the film-forming face, the rear face, and the pair of end faces, in which each of the pair of side faces includes a spreading face that spreads toward an outer side in an in-plane direction of the film-forming face from an edge part of the film-forming face toward the rear face side. A superconducting wire and a superconducting wire manufacturing method are also disclosed.