Superconducting Through-Hole Interconnects for Quantum Processors
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Solution Overview
Problem
Existing through-silicon via (TSV) technology using copper plating is not applicable to superconducting devices like quantum processors, as copper is not a superconducting material, leading to connection failures and reduced reliability.
Innovation Solution
A structure and method for manufacturing a quantum processor using a substrate with a through-hole and a superconducting wire that connects conductive portions on opposite surfaces without a plating layer, utilizing single-crystal sapphire for low dielectric loss and superconducting materials for reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper plating is used in through-silicon via technology, then electrical connection is achieved, but the device cannot be applied to superconducting quantum processors because copper is not a superconducting material
Solution Approach 1:
The invention changes the material parameter from copper (non-superconducting) to superconducting materials such as aluminum, niobium, or their alloys. This parameter change enables the through-hole structure to function in superconducting quantum processors while maintaining electrical connection reliability through direct metal-to-metal contact or superconducting adhesive bonding.
Solution Approach 2:
The invention employs composite material structures where superconducting materials are combined with substrate materials (silicon, sapphire, or glass) to create through-hole connections that maintain superconducting properties. The composite structure includes superconducting wires, foils, or particles embedded in the substrate through-holes, enabling both mechanical support and superconducting electrical connection.
2Reliability
If a plating layer is used to fill the through-hole, then electrical connection is established, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
The invention extracts and eliminates the copper plating layer from the through-hole structure, replacing it with direct insertion of superconducting materials. This removal of the plating process simplifies manufacturing by eliminating electroplating steps, reducing production time, and avoiding the complexity of multi-layer plating while maintaining reliable electrical connection through direct metal contact or superconducting adhesive bonding.
Solution Approach 2:
The invention performs preliminary preparation of superconducting materials (wires, foils, or particles) before substrate processing. The superconducting materials are pre-formed and ready for insertion into through-holes, allowing subsequent straightforward placement and connection processes without requiring complex in-situ plating operations, thereby simplifying the overall manufacturing sequence.
3Manufacturing precision
If conventional TSV technology is used, then through-hole connection is achieved, but noise increases and coherence time decreases in quantum processors
Solution Approach 1:
The invention changes the material parameter from non-superconducting copper to superconducting materials, which fundamentally alters the electrical properties of the through-hole connection. This parameter change eliminates resistive heating and electromagnetic radiation that cause noise, thereby extending coherence time in quantum processors while maintaining precise through-hole connection geometry.
Solution Approach 2:
The invention converts the previously harmful effect of using non-superconducting materials (which caused noise and reduced coherence time) into a benefit by employing superconducting materials that eliminate these harmful effects. The through-hole structure, originally a source of noise when filled with copper, becomes a low-noise connection path when filled with superconducting materials, turning the connection function into a coherence-preserving feature.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables reliable electrical connections and high integration of superconducting circuits, extending coherence time and reducing noise in quantum processors, thereby improving the operation and reliability of quantum computers.
Implementation Method 1
a wire extending through the through-hole and electrically connecting a first conductive portion located on the first surface and a second conductive portion located on the second surface
Implementation Method 2
utilizing single-crystal sapphire for low dielectric loss
Data Source
Figure 1~2
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Figure 6~8
AI summary
A structure includes a substrate and a wire. The substrate includes a first surface, a second surface opposite to the first surface, and a through-hole extending from the first surface to the second surface. The wire extends through the through-hole and electrically connects a first conductive portion located on the first surface and a second conductive portion located on the second surface.