Superconducting Wire Connection Structure Oxygen Diffusion Gap

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Solution Overview

Problem

Conventional techniques for connecting high temperature superconducting wires often result in a decrease in superconducting characteristics due to inadequate oxygen supply during the heat treatment process, leading to improper crystallization of the superconducting films.

Innovation Solution

A connection structure where a non-superconductor is provided on the surface of at least one superconducting wire, creating a gap at the joining portion that allows sufficient oxygen supply for crystallization of the superconducting layers, thereby maintaining the electrical characteristics during the connection of superconducting wires.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a film of solution containing metal is formed at the joint portion and heat treatment is performed to form a superconducting junction, then the superconducting wires can be connected, but the superconducting characteristic is lowered due to inadequate oxygen supply during heat treatment

Engineering Contradiction:
Improvesuperconducting characteristicVSAvoidheat treatment process
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent divides the heat treatment process into two separate stages: a first heat treatment at a lower temperature (300-600°C) to form the superconducting junction, and a second heat treatment at a higher temperature (700-900°C) to supply oxygen and crystallize the superconducting film. This segmentation resolves the contradiction by allowing the junction formation and oxygen supply to occur at different temperature stages, ensuring both connection reliability and superconducting characteristic maintenance.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent performs the first heat treatment at a lower temperature before the second heat treatment at a higher temperature. This preliminary action forms the superconducting junction structure first, then subsequently supplies oxygen through the second heat treatment to achieve proper crystallization. This sequential approach ensures that the junction is formed before oxygen diffusion occurs, resolving the contradiction between connection formation and superconducting property development.

Inventive Principle:
Principle #10Preliminary action

2Strength

If high temperature baking treatment is performed with superconducting thin films stuck to each other, then the films can be bonded, but proper oxygen supply is prevented and the film cannot be crystalized

Engineering Contradiction:
Improvebonding strengthVSAvoidcrystallization quality
Core Design Contradiction:
StrengthVSManufacturing precision

Solution Approach 1:

The patent segments the heat treatment into two distinct temperature stages: a first stage at 300-600°C for junction formation with initial bonding, and a second stage at 700-900°C for oxygen supply and crystallization. This segmentation allows bonding to occur first at lower temperature, then crystallization to occur at higher temperature without preventing oxygen diffusion, thus resolving the contradiction between bonding strength and crystallization quality.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent changes the temperature parameter in two distinct steps during heat treatment. The first heat treatment uses a lower temperature range (300-600°C) suitable for junction formation, while the second heat treatment uses a higher temperature range (700-900°C) that enables both strong bonding and proper oxygen diffusion for crystallization. This parameter change strategy resolves the contradiction by optimizing temperature for different process objectives at different stages.

Inventive Principle:
Principle #35Parameter changes

3Quantity of substance

If oxygen introducing treatment is performed after baking, then oxygen can be supplied, but it is impossible to secure the superconducting characteristic after connection

Engineering Contradiction:
Improveoxygen supplyVSAvoidsuperconducting characteristic
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent merges the oxygen introducing treatment with the second heat treatment process. The second heat treatment at 700-900°C serves dual purposes: it supplies oxygen to the superconducting film through diffusion and simultaneously performs the crystallization treatment necessary for superconducting properties. This merging of oxygen supply and heat treatment into a single process step resolves the contradiction by ensuring that oxygen is supplied under conditions that also promote crystallization and superconducting characteristic development.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the connection of superconducting wires while preserving their superconducting characteristics, ensuring strong and effective bonding without compromising the electrical properties.

Implementation Method 1

Oxygen is sufficiently supplied from the thus-formed gap to the joining portion between the superconducting wires, so that the superconducting layers at the joining portion is crystallized

Methodology Applied
Scientific EffectDiffusion: Diffusion

Implementation Method 2

Oxygen is sufficiently supplied from the thus-formed gap to the joining portion between the superconducting wires, so that the superconducting layers at the joining portion is crystallized

Methodology Applied
Scientific EffectCrystallization: Crystallisation

Data Source

PatentUS10541068B2Connection structure of superconducting wires
Publication Date: 2020.01.21 FURUKAWA ELECTRIC CO LTD
  • US10541068B2 patent drawing
  • US10541068B2 patent drawing
  • US10541068B2 patent drawing

AI summary

A connection structure of superconducting wires includes a plurality of superconducting wires are overlapped and connected with each other, each of the plurality of superconducting wires including a substrate and a superconducting layer that are laminated. A non-superconductor is provided at a part of a surface of the superconducting layer of at least one of the superconducting wires and protrudes from the surface.