Superconducting Wire Copper Layer Lamination
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Solution Overview
Problem
Current methods for manufacturing superconducting wires face challenges in efficiently laminating and stabilizing the superconducting tape, which affects the wire's performance and durability.
Innovation Solution
A method involving the formation of a copper protecting layer and a copper stabilizing layer on the superconducting tape, followed by lamination with metal tapes and a soldering process, to enhance the tape's stability and prevent oxidation, using physical deposition and electroplating techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a superconducting tape is directly laminated with metal tapes, then the lamination process becomes complex and difficult, but the structural stability and ease of manufacture are compromised
Solution Approach 1:
A copper layer is formed on the outer surface of the superconducting tape before lamination with metal tapes. This preliminary copper layer formation simplifies the subsequent lamination process by providing a compatible surface for bonding, while the overall structure remains relatively simple without requiring complex multi-layer configurations
Solution Approach 2:
The copper layer acts as an intermediary between the superconducting tape and the metal tapes. This intermediate copper layer facilitates the lamination process by providing a surface that is easier to bond with metal tapes, thereby simplifying manufacture without significantly increasing structural complexity
2Reliability
If the superconducting tape is stabilized with copper layers, then the stability and oxidation resistance improve, but the manufacturing process becomes more complex
Solution Approach 1:
The copper layer is formed on the superconducting tape surface before the lamination process. This preliminary stabilization step ensures the tape has adequate oxidation resistance and structural stability before being laminated with metal tapes, thereby improving reliability without requiring complex multi-step stabilization processes
Solution Approach 2:
The copper layer provides oxidation resistance by changing the chemical environment at the tape surface. This parameter change (adding a copper protective layer) improves reliability against oxidation while the manufacturing process remains relatively straightforward using standard deposition techniques
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for easy lamination and stabilization of the superconducting tape, improving its durability and resistance to external factors, thereby enhancing the overall performance of the superconducting wire.
Implementation Method 1
forming a copper protecting layer using a physical deposition method
Implementation Method 2
forming a copper stabilizing layer using an electroplating method on the copper protecting layer
Implementation Method 3
solder laminated onto opposite sides of a Cu/Ag/REBCO/LaMnO3/MgO/Y2O3/Al2O3/Hastelloy/Ag/Cu coated conductor tape
Implementation Method 4
a soldering process, to enhance the tape's stability
Data Source
Figure 1~3b
Figure 4~7
Figure 8~10b
AI summary
Provided is a method of manufacturing a superconducting wire. A superconducting tape having an outer surface is provided, a copper layer is formed on the outer surface of the superconducting tape, and first metal tape and second metal tape are respectively attached on a first surface and a second surface of the superconducting tape on which the copper layer is formed.