Encapsulated Superconducting Wire Layout for Low-Crosstalk Cryogenic Links
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional superconducting wires used in low temperature applications, such as the CRESST dark matter searching experiment, face challenges including increased space requirements, difficulty in shielding, non-reproducible crosstalk, and complex connections with hardware components.
Innovation Solution
A conductor device comprising multiple self-supporting superconducting wires encapsulated in an electrically insulating material, providing a continuous superconducting path with well-defined wire positions, improved mechanical stability, and enhanced connector lengths, while facilitating shielding and reducing crosstalk.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional superconducting wires with woven cables and mesh isolation are used, then superconducting performance is maintained, but space requirements increase and wire positions are not well defined
Solution Approach 1:
The patent replaces the conventional woven cable structure with thin film superconducting layers deposited on flexible substrates. This allows maintaining superconducting performance while significantly reducing the space and area occupied by the conductor device.
Solution Approach 2:
The invention changes the dimensional parameters of the superconducting structure from thick woven cables to thin film layers, reducing the cross-sectional area while maintaining the superconducting properties through controlled deposition parameters.
2Reliability
If conventional superconducting wires are used, then superconducting path is provided, but shielding against electromagnetic fields becomes difficult
Solution Approach 1:
The patent implements a nested structure where superconducting layers are deposited on both sides of the substrate, with ground reference layers and shielding layers integrated within the multi-layer stack. This nested arrangement provides effective electromagnetic shielding while maintaining the superconducting path.
Solution Approach 2:
The substrate and intermediate ground reference layers act as mediators between the superconducting paths, providing electromagnetic shielding and isolation. These intermediate layers block external electromagnetic fields from interfering with the superconducting signals.
3Reliability
If conventional superconducting wires are used, then superconducting connections are provided, but connecting to hardware components becomes difficult and time consuming
Solution Approach 1:
The patent segments the conductor device into modular units with standardized connection interfaces. The flexible substrate allows the superconducting wires to be easily routed and connected to hardware components, reducing connection time and complexity.
Solution Approach 2:
The flexible substrate enables dynamic routing and positioning of superconducting wires, allowing easy adaptation to different connection points on hardware components. This flexibility simplifies the connection process compared to rigid conventional wires.
4Reliability
If conventional superconducting wires are used, then superconducting path is provided, but crosstalk between different wires occurs
Solution Approach 1:
Ground reference layers and shielding layers are inserted as intermediaries between adjacent superconducting signal paths. These intermediate layers electrically isolate the signal paths, preventing capacitive and inductive coupling that causes crosstalk.
Solution Approach 2:
The patent applies different material properties and layer configurations locally between adjacent wires. Ground reference layers are positioned specifically between signal paths to provide localized shielding and isolation, reducing crosstalk at critical interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductor device achieves a compact arrangement of superconducting wires with reduced crosstalk, improved shielding, and simplified connections, making it suitable for low temperature applications with a large number of signal channels.
Implementation Method 1
the conductor wires have electric superconductivity at an operation temperature equal to or below -196 °C (about 77 K), preferably equal to or below -269 °C (about 4 K)
Data Source
Figure 1~3
Figure 4~7
AI summary
A conductor device 100, preferably being adapted for low temperature applications, comprises multiple conductor wires 10 being arranged along a longitudinal extension of the conductor device 100, and an electrically insulating encapsulation material 20, wherein the conductor wires 10 are encapsulated in the encapsulation material 20, so that each conductor wire 10 is covered by the encapsulation material 20 in all radial directions relative to the longitudinal extension of the conductor device 100, wherein the conductor wires 10 have electric superconductivity at an operation temperature equal to or below -196 °C, and each conductor wire 10 has two longitudinal end sections 11 and a self-supporting wire section 12 therebetween. Furthermore, an electrical conductor arrangement including the conductor device and a method of manufacturing the conductor device 100 are described.