Superconducting Wire With Detachable Coating Layers
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Solution Overview
Problem
Conventional superconducting wires and coils face deterioration due to thermal stress resulting from differences in thermal expansion coefficients between the superconducting layer and impregnating materials, leading to complex manufacturing processes and potential breakage of the superconducting layer.
Innovation Solution
A superconducting wire design with a substrate and superconducting layer, where coating layers are applied with varying adhesion strengths to detach from the substrate before thermal stress affects the superconducting layer, and a coil configuration with an insulator having a higher thermal expansion coefficient than the superconducting layer to mitigate thermal stress without complicating the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the superconducting wire is impregnated with impregnating material having different thermal expansion coefficient, then the wire structure is stabilized, but thermal stress causes superconducting layer breakage
Solution Approach 1:
The patent applies preliminary action by forming a releasing material layer on the insulating material layer before the impregnating material is applied. This releasing material layer pre-establishes a detachment mechanism that will activate during thermal cycling, allowing the impregnating material to be readily detached from the insulating material layer when thermal stress occurs, thereby preventing superconducting layer breakage while maintaining wire structure stability
Solution Approach 2:
The patent uses an intermediary approach by introducing a releasing material layer as a mediator between the insulating material layer and the impregnating material. This intermediate layer facilitates controlled detachment during thermal stress, acting as a buffer that protects the superconducting layer from direct mechanical stress while allowing the impregnating material to stabilize the wire structure
2Reliability
If conventional configurations are used to prevent superconducting layer breakage, then manufacturing process becomes complex, but superconducting property is preserved
Solution Approach 1:
The patent merges multiple functions into a single integrated structure: the insulating material layer serves both as an electrical insulator and as a substrate for the releasing material layer, while the releasing material layer simultaneously provides thermal expansion buffering and facilitates controlled detachment. This merging eliminates the need for separate complex manufacturing steps while preserving superconducting property
Solution Approach 2:
The patent applies parameter changes by carefully selecting materials with specific thermal expansion coefficients: the insulating material layer has a thermal expansion coefficient different from both the superconducting wire and the impregnating material, creating a controlled thermal stress gradient. This parameter optimization allows the system to withstand thermal cycling without requiring complex manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses superconducting property deterioration from thermal stress without adding new manufacturing steps, ensuring the superconducting wire and coil maintain performance by detaching coating layers from the substrate before thermal stress impacts the superconducting layer.
Implementation Method 1
thermal stress resulting from a difference between the thermal expansion coefficient of the impregnating material and the thermal expansion coefficient of the superconducting wire
Data Source
AI summary
A superconducting wire according to one embodiment of the present disclosure includes: a substrate having a first surface and a second surface; a superconducting layer having a third surface and a fourth surface; and respective coating layers. The second surface is opposite to the first surface. The fourth surface is opposite to the third surface. The superconducting layer is disposed on the substrate such that the third surface faces the second surface. The respective coating layers are disposed on the first surface and the fourth surface. Adhesion strength between the substrate and the coating layer disposed on the first surface is lower than adhesion strength between the superconducting layer and the coating layer disposed on the fourth surface.