Superconducting Wire Joint Structure for Low-Resistance High-Stress Coils
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing superconducting wire connections face challenges in achieving low electrical resistance and high mechanical strength, particularly in nuclear magnetic resonance (NMR) and magnetic resonance imaging (MRI) apparatuses, where connectors are required to withstand high mechanical stress and maintain efficient current flow.
Innovation Solution
A superconducting wire structure is developed with a joint layer and connecting member made of materials like Ag, Cu, and Ge, having a melting point between 900°C and 1100°C, which is heat-treated under pressure to form a stable joint layer with controlled porosity and particle size, ensuring strong mechanical bonding and efficient current pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a connector is used to connect superconducting wires, then electrical connection is achieved, but mechanical strength is insufficient under high stress conditions
Solution Approach 1:
The patent merges the electrical connection function and mechanical bonding function into a single integrated joint layer. The joint layer simultaneously provides electrical conductivity for current flow and mechanical strength to withstand high stress, eliminating the need for separate connectors and achieving both low electrical resistance and high mechanical strength through unified material composition and structure.
2Strength
If heat treatment is applied to improve joint stability, then mechanical strength increases, but particle extrusion occurs
Solution Approach 1:
The patent optimizes heat treatment parameters including temperature range, holding time, and cooling rate to achieve desired joint properties without causing particle extrusion. By precisely controlling these thermal parameters, the joint layer develops adequate mechanical strength and stability while preventing harmful material degradation and particle expulsion that would otherwise occur during heat treatment.
3Productivity
If multiple superconducting wires are connected to increase wire length, then productivity increases, but connection reliability decreases
Solution Approach 1:
The patent uses a homogeneous joint layer composition and uniform bonding process to ensure consistent connection quality across multiple wire joints. This homogeneity in material properties and processing conditions maintains high connection reliability even when connecting multiple wires to achieve extended lengths, preventing the degradation of reliability that typically occurs with repeated connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the mechanical strength and reduces electrical resistance, allowing for improved performance in NMR and MRI apparatuses by maintaining stable current flow and preventing particle extrusion during heat treatment.
Implementation Method 1
heat-treated under pressure to form a stable joint layer with controlled porosity and particle size
Implementation Method 2
heat-treated under pressure to form a stable joint layer
Implementation Method 3
a joint layer electrically connecting the first superconducting wire and the second superconducting wire
Implementation Method 4
The connecting member has a melting point equal to or more than 900° C. and equal to or less than 1100° C.
Data Source
AI summary
A superconducting wire structure of embodiments includes: a first superconducting wire; a second superconducting wire adjacent to the first superconducting wire; a joint layer electrically connecting the first superconducting wire and the second superconducting wire; and a connecting member connecting the joint layer and at least one of the first superconducting wire and the second superconducting wire. The connecting member has a melting point equal to or more than 900° C. and equal to or less than 1100° C.