Superconducting Wire Pretreatment for Substrate-Buffer Adhesion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The peeling phenomenon between the metal substrate and the buffer layer occurs during the deposition process of superconducting wires due to accumulated stress at high temperatures, which affects the adhesion and integrity of the multilayer film.
Innovation Solution
An apparatus for manufacturing superconducting wires includes a pretreatment module that performs a predetermined process, such as forming an adhesive layer or plasma surface treatment, before depositing the buffer layer on the substrate, and a configuration of deposition modules with identical structures to enhance adhesion and reduce manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a multilayer film is deposited by sequentially forming buffer layer and superconducting layer on metal substrate, then current transport capacity is improved, but peeling phenomenon occurs between substrate and buffer layer due to accumulated stress at high temperature
Solution Approach 1:
The patent applies preliminary action by performing plasma surface treatment on the metal substrate before depositing the buffer layer. This pretreatment modifies the substrate surface properties in advance, creating a more favorable surface for subsequent buffer layer deposition and reducing the occurrence of peeling phenomenon during high-temperature processing.
Solution Approach 2:
The patent introduces an intermediary adhesive layer between the metal substrate and the buffer layer. This intermediate layer acts as a mediator that reduces the direct stress concentration at the substrate-buffer interface, thereby preventing peeling while maintaining the structural integrity of the multilayer film.
2Reliability
If pretreatment module is added to perform adhesive layer formation or plasma surface treatment, then adhesion is reinforced, but device complexity increases
Solution Approach 1:
The patent merges the pretreatment function into the existing deposition module structure. The plasma generation device is integrated within the deposition chamber, allowing the pretreatment and deposition processes to be performed in a single integrated unit, thereby reducing overall device complexity while maintaining enhanced adhesion.
Solution Approach 2:
The deposition module is designed with multi-functionality, serving both as a pretreatment chamber (for plasma surface treatment or adhesive layer formation) and as a deposition chamber (for buffer and superconducting layer deposition). This universal design eliminates the need for separate pretreatment equipment, reducing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus reinforces the adhesion between the substrate and buffer layer, improves the crystallinity and surface roughness of the superconducting wires, and simplifies the equipment design by using identical deposition modules.
Implementation Method 1
The pretreatment module may be configured to perform plasma surface treatment on the substrate
Implementation Method 2
the deposition device may be a sputtering deposition device
Implementation Method 3
the deposition device may be a sputtering deposition device or an electron beam deposition device
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The present disclosure relates to an apparatus for manufacturing superconducting wires, and more particularly, to an apparatus for manufacturing superconducting wires capable of reinforcing an adhesion between a substrate and a buffer layer by performing a predetermined pretreatment process before the buffer layer is deposited on the substrate.