Superconducting Wire Side Surface Coating for Peeling Prevention
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Solution Overview
Problem
Superconducting wires with a ceramic layer on a metal substrate face issues due to thermal expansion coefficient differences, leading to tensile stress and local peeling of the superconducting material layer, which can cause breakage and deformation, thereby deteriorating the superconducting properties.
Innovation Solution
A superconducting wire design where the superconducting material layer covers at least part of the substrate's side surface, increasing the bonding area and conforming to the substrate's contraction, preventing peeling and maintaining stable superconducting properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the superconducting material layer is formed only on the main surface of the substrate, then the manufacturing process is simple, but the bonding strength is insufficient and local peeling occurs due to thermal expansion differences
Solution Approach 1:
The superconducting material layer is extended from covering only the main surface (2D plane) to also covering the side surface of the substrate, adding a dimensional aspect that increases the bonding interface area. This dimensional extension allows the layer to wrap around the substrate edges, preventing peeling while maintaining manufacturing feasibility through continuous deposition processes
2Strength
If the superconducting material layer covers the side surface of the substrate, then the bonding strength increases and peeling is suppressed, but the manufacturing complexity increases
Solution Approach 1:
The superconducting material layer is applied selectively to different surfaces of the substrate - covering the entire main surface and extending onto the side surface. This local quality approach ensures enhanced bonding strength is provided exactly where needed (at the edges and sides prone to peeling) while maintaining the necessary superconducting properties in the functional areas
3Area of stationary object
If the superconducting material layer covers the side surface, then the bonding area increases and peeling is prevented, but the amount of material required increases
Solution Approach 1:
By extending the superconducting material layer onto the side surface of the substrate, the bonding area is increased in a vertical dimension rather than requiring a proportional increase in horizontal area. This dimensional approach provides additional bonding perimeter along the substrate edges, preventing peeling while using material efficiently along the vertical wrap-around geometry
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances the bonding strength between the substrate and the superconducting material layer, preventing peeling and deformation, thus stabilizing the superconducting properties and improving the wire's performance.
Implementation Method 1
When such a superconducting wire is cooled to the critical temperature, a difference in thermal expansion coefficient between the metal substrate and the ceramic layer causes a tensile stress to be applied from the metal layer to the ceramic layer
Data Source
AI summary
A superconducting wire includes: a substrate having a first main surface and a second main surface opposite to the first main surface; and a superconducting material layer disposed on the first main surface of the substrate. The superconducting material layer is disposed to cover at least a part of a side surface of the substrate in a width direction of the substrate.