Superconducting Wire Surface Roughness for Resin Peeling Resistance
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Solution Overview
Problem
The existing superconducting wires may experience peeling of the insulating resin layer, which compromises their performance and reliability.
Innovation Solution
A superconducting wire configuration is developed, featuring a substrate with a specific surface texture, including an arithmetic average roughness greater than 0.02 μm and a maximum height roughness less than 5 μm, to prevent peeling of the insulating resin layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the insulating resin layer is applied on a smooth substrate surface, then the manufacturing process is simple, but the resin layer peels off during use
Solution Approach 1:
The substrate surface roughness parameters are precisely controlled within specific ranges (Ra: 0.003-0.03μm, Rz: 0.05-0.5μm) to optimize adhesion. By changing the surface topology parameters without altering the material composition, the patent achieves reliable resin layer bonding while maintaining manufacturing feasibility through standardized polishing processes.
Solution Approach 2:
The patent applies different surface quality requirements to different regions of the substrate. The surface area contacting the insulating resin layer is specifically engineered with controlled roughness for optimal adhesion, while other areas maintain their original properties. This localized quality enhancement ensures reliable bonding only where needed without unnecessary complexity elsewhere.
2Reliability
If the substrate surface roughness is increased to prevent peeling, then the adhesion improves, but the manufacturing precision requirements increase
Solution Approach 1:
The patent defines specific ranges for surface roughness parameters (Ra: 0.003-0.03μm, Rz: 0.05-0.5μm) that balance adhesion performance with manufacturing capability. These parameter specifications enable consistent quality control through standard measurement and polishing techniques without requiring ultra-precision manufacturing equipment.
Solution Approach 2:
The patent applies a moderate increase in surface roughness within controlled limits rather than maximizing roughness. This partial action approach provides sufficient adhesion improvement while staying within manufacturing precision capabilities, avoiding the diminishing returns and excessive complexity that would result from more aggressive surface treatment.
Data Source
AI summary
A superconducting wire includes a substrate and a superconducting layer. The substrate has a first surface and a second surface. The second surface is opposite to the first surface. The superconducting layer faces the first surface. The second surface has an arithmetic average roughness larger than 0.02 μm. The second surface has a maximum height roughness smaller than 5 μm.