Superconductive Integrated Circuit Manufacturing via Segmented Layering

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Solution Overview

Problem

Existing manufacturing methods for superconductive integrated circuits, such as shadow mask evaporation and lift off, face reproducibility issues, high defect density, and limitations in scaling both in dimension and stacking.

Innovation Solution

A method of manufacturing a superconductive integrated circuit on a substrate involves forming a first superconductive layer, structuring it to form disconnected structures, and then building a Josephson junction layer stack with a barrier layer. A dielectric cover layer is applied and structured to expose the Josephson junction structure, followed by the deposition and structuring of a second superconductive layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If shadow mask evaporation and lift off processes are used to manufacture superconductive integrated circuits, then Josephson junction structures can be formed, but reproducibility is poor and defect density is high

Engineering Contradiction:

ImprovereproducibilityVSAvoiddefect density

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The manufacturing process is divided into distinct sequential steps: forming the first superconductive layer, depositing the JJ layer stack, structuring the JJ layer stack, forming the dielectric cover layer, and depositing the second superconductive layer. Each step is independently controlled and optimized, replacing the monolithic shadow mask evaporation process with a segmented approach that improves reproducibility and reduces defects.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The first superconductive layer is formed and structured before the JJ layer stack is deposited. The dielectric cover layer is formed and structured before the second superconductive layer is deposited. This preliminary structuring of underlying layers provides a controlled foundation that improves the reproducibility and reduces defects in subsequent steps.

Inventive Principle:

Principle #10Preliminary action

2Adaptability or versatility

If shadow mask evaporation and lift off processes are used, then Josephson junction structures can be formed, but scaling in dimension and stacking is limited

Engineering Contradiction:

Improvescaling capabilityVSAvoidintegration complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The process transitions from planar 2D patterning to 3D vertical stacking by forming multiple superconductive layers separated by dielectric cover layers. The Josephson junction layer stack is deposited over the first superconductive layer, and the second superconductive layer is deposited over the dielectric cover layer, enabling vertical integration and scaling in the third dimension.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The Josephson junction layer stack is nested within the structure formed by the first and second superconductive layers. The dielectric cover layer is nested between the superconductive layers, creating a compact integrated structure that enables scaling while managing complexity through hierarchical organization.

Inventive Principle:

Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enhances the reproducibility and reduces defect density in the manufacturing of superconductive integrated circuits, allowing for scalable integration of Josephson junctions and improved performance in applications such as quantum computing and parametric amplifiers.

Implementation Method 1

forming a first superconductive layer of a superconductive material over the substrate... A second superconductive layer of a superconductive material is formed over the dielectric cover layer

Methodology Applied

Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Implementation Method 2

A Josephson junction (JJ) layer stack including a JJ barrier layer is formed over the first superconductive layer. The JJ layer stack is structured to form a JJ structure

Methodology Applied

Scientific EffectJosephson effect: Josephson Effect

Data Source

PatentUS20250160221A1Method of manufacturing a superconductive integrated circuit

Publication Date: 2025.05.15 INFINEON TECHNOLOGIES AG

AI summary

A method of manufacturing a superconductive integrated circuit on a substrate includes forming a first superconductive layer of a superconductive material over the substrate. A Josephson junction (JJ) layer stack including a JJ barrier layer is formed over the first superconductive layer. The JJ layer stack is structured to form a JJ structure. The first superconductive layer is structured to form a structured first superconductive layer. A dielectric cover layer is formed over the JJ structure. The dielectric cover layer is structured a first time to expose an upper side of the JJ structure. A second superconductive layer of a superconductive material is formed over the dielectric cover layer. The second superconductive layer is structured to form a structured second superconductive layer.