Superconductive Conductor Stacking With Liquid Solder Bonding
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Solution Overview
Problem
Current methods for producing superconducting conductors with high current densities and mechanical stability are inadequate, particularly for high-temperature superconductors like REBCO tapes, as they require new approaches beyond conventional stranding techniques due to their flat strip form and high cooling demands.
Innovation Solution
A method involving the use of liquid solder to connect and stack superconductor tapes, forming a ribbon stack that is then processed into a compact, mechanically stable superconductor body using a roller system, which can include twisting for improved current distribution and mechanical support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional stranding techniques are used for producing high-current-carrying cables, then mechanical stability can be achieved, but these techniques cannot be applied to flat superconductor ribbons due to their specific geometry
Solution Approach 1:
The patent changes the manufacturing parameters by transitioning from conventional stranding techniques to a stacking approach with liquid solder application. Flat ribbons are stacked and connected using liquid solder that is applied and then solidified, creating a mechanically stable structure suitable for flat superconductor geometries while maintaining high current-carrying capacity
Solution Approach 2:
Liquid solder serves as an intermediary material that connects the flat superconductor ribbons. The solder is applied in liquid form, allows the ribbons to be stacked and positioned, then solidifies to provide mechanical stability and electrical connection between the ribbons, enabling manufacture of high-current cables from flat ribbon geometry
2Productivity
If the volume to be cooled is reduced to achieve high current densities, then power density improves, but mechanical stability becomes more difficult to maintain
Solution Approach 1:
The patent creates a composite structure by stacking multiple flat superconductor ribbons and connecting them with solidified liquid solder. This composite construction achieves high current density through the stacked arrangement while the solder matrix provides the necessary mechanical stability, allowing reduced cooling volume without sacrificing structural integrity
3Productivity
If flat superconductor ribbons are stacked to form high-current conductors, then current density increases, but the structure requires new manufacturing approaches beyond conventional techniques
Solution Approach 1:
The patent replaces conventional mechanical stranding techniques with a process involving liquid solder application and solidification. Instead of mechanically twisting or braiding conductors, flat ribbons are stacked and connected through the phase change of solder from liquid to solid, creating a simpler manufacturing process suitable for flat ribbon geometry while achieving high current density
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of superconducting conductors with enhanced current densities and mechanical stability, reducing cooling volume and improving power density while maintaining high current-carrying properties and mechanical integrity.
Implementation Method 1
applying liquid solder to the plurality of conductive tapes by immersing the conductive tapes in a solder bath
Data Source
Figure 1
Figure 2a~2b
Figure 3
AI summary
The present invention relates to a method and a device (500) for producing a superconductive conductor (100). The method thereby comprises the following steps: providing a plurality of conductive strips (1, 2) with the aid of a strip-providing device (200), wherein the plurality of conductive strips comprises at least one superconductive strip; applying fluid soldering agent to the plurality of conductive strips (1, 2) with the aid of a soldering device (350); stacking the conductive strips (1, 2) wetted with soldering agent with the aid of a stack-generating device (300); forming a superconductive body (40) by processing the band stack with the aid of a roller system (400).