Superconductor Interconnect System for Cryogenic Signal Propagation
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Solution Overview
Problem
Superconducting computer systems face significant design constraints in cryogenic conditions, particularly in facilitating high-speed communication between components, as existing interconnect systems struggle to maintain signal propagation and shielding effectively.
Innovation Solution
A superconductor interconnect system comprising superconducting signal lines and an interconnect structure with metallic contacts, such as gold layers or nanolattice structures, that provide reliable signal propagation and shielding by maintaining superconducting capability through pressurized contact and oxidation removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional interconnect systems are used in superconducting computer systems, then the system can operate in cryogenic conditions, but signal propagation and shielding effectiveness deteriorate
Solution Approach 1:
The patent changes the material parameter from conventional conductors to superconducting materials, which fundamentally alters the electrical resistance parameter to near-zero values at cryogenic temperatures. This enables reliable signal propagation by eliminating resistive losses that plague conventional interconnect systems in the same temperature regime.
Solution Approach 2:
The patent applies different material properties to different parts of the interconnect system. Superconducting signal lines are used where signal propagation is critical, while superconducting shielding structures are applied where electromagnetic interference protection is needed. This localized application of superconducting properties optimizes performance for specific functional requirements.
2Speed
If superconducting signal lines are used to maintain signal propagation, then high-speed communication is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the interconnect system into discrete modular components including individual superconducting signal lines, separate shielding structures, and distinct connector elements. This segmentation allows each component to be manufactured and tested independently, then assembled into complete interconnect assemblies, thereby managing manufacturing complexity through modularity.
Solution Approach 2:
The patent designs superconducting interconnect components that can serve multiple functions. For example, the same superconducting material and fabrication processes are used for both signal transmission lines and shielding structures, and connectors are designed to provide both electrical connection and mechanical alignment. This multi-functionality reduces the number of different component types needed.
3Reliability
If interconnect contacts are added to facilitate signal propagation between cables, then connection reliability improves, but the risk of oxidation and contact failure increases
Solution Approach 1:
The patent employs composite material structures at contact portions, combining superconducting materials with protective coating layers. The superconducting material provides the necessary electrical conductivity and signal propagation properties, while the protective coating layer (such as gold or other oxidation-resistant materials) prevents oxidation. This composite structure simultaneously achieves both electrical performance and environmental stability.
Solution Approach 2:
The patent applies protective measures to contact portions before they are exposed to the environment. Protective coating layers are deposited on superconducting contact surfaces during the fabrication process, creating a pre-protected interface that is resistant to oxidation. This preliminary protection prevents contact degradation before reliability issues can arise during operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient propagation of superconducting signals, such as single flux quantum (SFQ) or reciprocal quantum logic (RQL) signals, across long distances and between computing devices, maintaining high-speed communication in cryogenic environments.
Implementation Method 1
a first cable comprising a first superconducting signal line formed from a superconductor material to propagate a respective at least one signal
Implementation Method 2
at least one interconnect contact disposed on the first, second, and third at least one superconducting signal line at a contact portion between each of the at least one first and third superconducting signal lines and the at least second and third superconducting signal lines
Data Source
AI summary
One embodiment includes a computer interconnect system. The system includes a first cable comprising a first superconducting signal line formed from a superconductor material to propagate at least one signal and a second cable comprising a second superconducting signal line formed from the superconductor material to propagate the respective at least one signal. The system also includes an interconnect structure configured to contact each of the first and second cable and comprising a third superconducting signal line formed from the superconductor material and configured to propagate the respective at least one signal between the respective first and second superconducting signal line. The system further includes at least one interconnect contact disposed on the first, second, and third at least one superconducting signal line at a contact portion between each of the at least one first and third superconducting signal lines and the at least second and third superconducting signal lines.