Superconductor-Metal Conductive Paste for Ultra-Low-Temperature Components
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Solution Overview
Problem
Existing passive electronic components fail to effectively operate at ultra-low temperatures below 223K due to inability to input current and mismatched expansion coefficients leading to structural and electrical failures.
Innovation Solution
A superconductor-metal conductive material is developed, comprising a metal powder, a superconductor powder, and an organic carrier adhesive, with specific weight percentages and particle size ranges, to enhance conductivity and match expansion coefficients with ceramic materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional conductive materials are used in passive components, then the components can be manufactured with standard materials, but the components fail to operate at ultra-low temperatures below 223K due to inability to input current
Solution Approach 1:
The patent uses a composite material consisting of superconducting powder (such as YBCO, BSCCO, or TBCO) mixed with metal powder (such as silver, aluminum, or copper) to create a conductive slurry. This composite material combines the ultra-low temperature conductivity of superconductors with the electrical conductivity and processability of metals, enabling passive components to operate reliably below 223K while maintaining manufacturability.
Solution Approach 2:
The patent changes the physical and chemical parameters of the conductive material by controlling the particle size distribution (D10, D50, D90 values), weight ratios of superconducting powder to metal powder (typically 3:7 to 7:3), and organic carrier composition. These parameter optimizations ensure the composite material maintains appropriate viscosity, conductivity, and thermal properties for ultra-low temperature operation.
2Ease of manufacture
If conventional conductive materials are used, then the manufacturing process is simple, but mismatched expansion coefficients lead to discontinuity between conductor layer and ceramic layer
Solution Approach 1:
The patent optimizes the particle size parameters of the composite conductive material (D10: 0.5-2.0 μm, D50: 3-8 μm, D90: 15-30 μm) to match the thermal expansion characteristics of ceramic substrates. This parameter control ensures that the conductor layer and ceramic layer expand and contract at compatible rates during temperature cycling, preventing discontinuity and maintaining structural integrity.
Solution Approach 2:
The composite material formulation includes not only superconducting powder and metal powder but also specific organic carriers and sintering aids that facilitate bonding between the conductor layer and ceramic layer. This multi-component composite ensures both thermal expansion compatibility and strong adhesion, maintaining structural continuity through temperature variations.
3Stability of the object's composition
If glass powder is replaced with superconducting oxide, then the expansion coefficient can be matched with ceramic materials, but the material composition becomes more complex
Solution Approach 1:
The patent replaces glass powder with a composite system of superconducting oxide powder combined with metal powder and organic carriers. This substitution provides dual benefits: the superconducting oxide matches the thermal expansion coefficient of ceramic materials, while the metal powder component maintains electrical conductivity. The organic carrier facilitates processing and sintering, simplifying the overall manufacturing despite the advanced material composition.
Solution Approach 2:
The superconducting oxide in the composite material serves multiple functions simultaneously: it provides thermal expansion matching with ceramic substrates, enables ultra-low temperature conductivity, and acts as a sintering aid during processing. This multi-functionality reduces the need for separate additives and simplifies the overall material system despite the sophisticated composition.
4Reliability
If superconducting powder is used as conductive filler, then conductivity at ultra-low temperatures is improved, but the manufacturing complexity increases due to special material requirements
Solution Approach 1:
The patent creates a composite conductive material where superconducting powder is combined with conventional metal powder (silver, aluminum, or copper) and organic carriers. This composite approach maintains the ultra-low temperature conductivity of superconductors while incorporating the excellent processability and conductivity of metals, allowing standard manufacturing techniques to be used with minimal modification.
Solution Approach 2:
The patent optimizes critical parameters including the weight ratio of superconducting powder to metal powder (3:7 to 7:3), particle size distribution (D10: 0.5-2.0 μm, D50: 3-8 μm, D90: 15-30 μm), and organic carrier composition. These parameter optimizations ensure the composite material has appropriate viscosity for screen printing, proper green strength for handling, and adequate conductivity for ultra-low temperature operation, simplifying the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the reliability of passive components in harsh low-temperature environments by reducing impedance and increasing reliability at both low and high temperatures, with a significant reduction in resistance value and energy consumption.
Implementation Method 1
the superconductor powder comprises one or more mixtures of La2-x-ySrxBayCuO4, La2-x-y BixSryCuO4, La2-x-y-z BixSryCaZCuO4, La2-x-y-z HgxBayCazCuO4, La2-x-ySrxTlyBazCuO6, La2-x-y-z-wSrxTlyBazCawCu2O8, HgBa2Ca2Cu3O8
Implementation Method 2
the organic carrier adhesive comprises one or more mixtures of polyvinyl butyral, ethyl cellulose, polyvinyl acetate, polyethylene oxide, carboxymethyl cellulose, styrene-butadiene rubber, polyacrylic acid, and polymethyl methacrylate
Data Source
AI summary
The invention discloses a superconductor-metal conductive material, comprising a metal powder, a superconductor powder and an organic carrier adhesive, wherein the metal powder has 50-95 wt % of a total weight of said metal powder, said superconductor powder and said organic carrier binder, the superconductor powder has 4-40 wt % of said total weight, and the organic carrier binder has 1-10 wt % of said total weight, wherein the superconductor powder comprises one or more mixtures of La2-x-ySrxBayCuO4, La2-x-y BixSryCuO4, La2-x-y-z BixSryCaZCuO4, La2-x-y-z HgxBayCazCuO4, La2-x-ySrxTlyBazCuO6, La2-x-y-z-wSrxTlyBazCawCu2O8, and HgBa2Ca2Cu3O8, where each of x, y, z, and w is between 0.1 and 0.9.