Superconductor Structure Using Overlapping Tape Sections
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Solution Overview
Problem
Current superconductor structures face limitations in carrying high currents over long distances due to limited lengths of good-quality tape-shaped superconductors and high ohmic losses above critical temperatures, with metallic superconductors having low transition temperatures and high-temperature superconductors being difficult to process.
Innovation Solution
A superconductor structure comprising linked tape pieces with superconducting layers facing each other, connected by normally conducting layers of high electrical conductivity materials like silver or copper, allowing for extensive length configurations and minimizing ohmic resistance through large contact areas and overlapping lengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If tape-shaped superconductors are used to transmit electricity over long distances, then current-carrying capacity is improved, but ohmic losses increase due to limited tape lengths and connection points
Solution Approach 1:
A normally conducting intermediate layer is introduced between the superconducting layers of adjacent tape pieces. This intermediate layer provides a controlled conduction path that reduces contact resistance at connection points, thereby minimizing ohmic losses while enabling extended transmission distances through multiple connected segments.
Solution Approach 2:
The superconductor structure is divided into multiple tape pieces that can be manufactured to feasible lengths and then connected in series. This segmentation allows the system to achieve long transmission distances while managing the inherent limitations of individual tape lengths and reducing cumulative ohmic losses through optimized connections.
2Quantity of substance
If high-temperature superconducting materials are used, then current density capacity is improved, but manufacturing difficulty increases due to ceramic properties
Solution Approach 1:
The structure employs a composite design combining high-temperature superconducting ceramic layers with metallic substrates and buffer layers. This composite approach leverages the high current density capacity of the ceramic superconductor while the metallic components provide mechanical flexibility and ease of processing, effectively resolving the manufacturing difficulty associated with pure ceramic superconductors.
Solution Approach 2:
Different regions of the tape structure have specialized functions: the ceramic superconducting layer provides high current density capacity locally, while the metallic substrate and buffer layers provide mechanical support and processability in other regions. This local differentiation allows the system to achieve high performance without sacrificing manufacturability.
3Ease of manufacture
If metallic superconductors are used, then ease of processing is improved, but transition temperature decreases requiring expensive cooling
Solution Approach 1:
The patent uses composite structures where high-temperature superconducting ceramic materials are deposited on metallic substrates. This combination achieves higher transition temperatures than pure metallic superconductors, reducing cooling requirements, while the metallic substrate maintains ease of processing and mechanical handling properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure achieves high current-carrying capacity and efficient power transmission over long distances, such as kilometers, with negligible ohmic resistance and enhanced stability through the use of high-temperature superconducting materials and buffer layers, enabling flexible and efficient superconductor configurations.
Implementation Method 1
Superconductors can carry electrical currents with practically no ohmic losses. They are used in particular where high electrical currents are required
Implementation Method 2
The superconducting layers are connected via one or more normally conducting intermediate layers (e.g. top layers of the individual pieces of tape)
Data Source
Figure 1~2
Figure 3a~3b
Figure 4a~4f
AI summary
The structure (1) has a substrate (3) provided with interlinked tape sections (2, 7a, 7b) that are placed on superconducting layers (4). The tape pieces and the superconducting layers are connected with each other. The interlinked tape sections are connected with the superconducting layers, where the interlinked tape sections are overlapped along entire length (L) of third interlinked tape section. Two edge-side tape sections are connected with the interlinked tape sections and the superconductive layers. A gap (6) is formed between the tape sections. An independent claim is also included for a method for passing electric current along a superconductor structure.