Superconductor Chip Interconnect Using Deforming Pin Contacts
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Solution Overview
Problem
Existing superconductor devices face challenges in maintaining reliable electrical connections between circuit boards and superconductor circuit chips due to temperature changes, as mercury-based connections are unreliable and prone to defects.
Innovation Solution
The use of pins inserted into wiring layers of a multi-layer board or interposer in a direction intersecting the wiring layers, allowing for plastic and elastic deformation to ensure a large contact area and secure electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If mercury spheres are used to maintain electrical connections between micropins and wiring modules, then the connections can accommodate relative displacement due to temperature changes, but the use of mercury creates reliability issues and potential defects in low-temperature environments
Solution Approach 1:
The patent removes mercury from the connection system entirely, replacing it with a mechanical deformation mechanism where the wiring layer itself deforms to accommodate relative displacement between micropins, eliminating mercury-related reliability issues while maintaining adaptability
Solution Approach 2:
The patent changes the physical state and behavior of the wiring layer by allowing it to deform plastically and elastically in response to temperature-induced displacement, transforming the rigid wiring structure into a flexible connection medium that maintains electrical contact without mercury
2Reliability
If pins are inserted into wiring layers in a direction intersecting the wiring layers, then a large contact area is achieved through plastic and elastic deformation, but the manufacturing process becomes more complex
Solution Approach 1:
The pin insertion process is performed as a preliminary action during assembly, where pins are inserted through holes in the wiring layer before final positioning, allowing the wiring layer to deform around the pins and create reliable contacts without requiring complex post-processing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the reliability of electrical connections by ensuring a large contact area and consistent contact pressure, reducing the risk of defects caused by temperature changes.
Implementation Method 1
allowing for plastic and elastic deformation to ensure a large contact area and secure electrical connections
Implementation Method 2
allowing for plastic and elastic deformation to ensure a large contact area and secure electrical connections
Data Source
AI summary
A superconductor device provided with a superconductor circuit chip; a multi-layer board including multiple wiring layers; and multiple pins electrically connecting the superconductor circuit chip with the multi-layer board; wherein the multiple pins are inserted into a wiring layer of the multi-layer board in a direction intersecting the wiring layer. Additionally, a superconductor device provided with a superconductor circuit chip; a multi-layer board including multiple wiring layers; an interposer that is disposed between the multi-layer board and the superconductor circuit chip, that is electrically connected to the superconductor circuit chip, and that has a wiring layer connected to a wiring layer of the wiring layers; and multiple pins electrically connecting the interposer with the multi-layer board; wherein the multiple pins are inserted into at least one of the wiring layer in the multi-layer board and in the interposer in a direction intersecting the wiring layer.