Superconducting Tape Silver Overlayer Oxygenation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional superconductor manufacturing processes are inefficient, leading to high yield losses and increased costs due to lengthy oxygenation steps and manual handling, which can damage the high-value-added superconducting tapes.

Innovation Solution

A method that reduces the oxygenation time to 30 minutes at 400°C and eliminates the second oxygenation step, along with silver deposition at temperatures below 250°C, and electroplating of copper, to streamline the process and minimize handling risks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional oxygenation heat treatment is conducted for more than 20 hours, then the superconducting film achieves proper oxygenation and performance, but the manufacturing time and cost increase significantly

Engineering Contradiction:
Improvesuperconducting film performanceVSAvoidmanufacturing time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent changes the oxygenation parameters by conducting the heat treatment in two stages: first at a higher temperature (400-500°C) for a shorter duration (5-10 minutes) to rapidly oxygenate the bulk, then at a lower temperature (200-300°C) for a longer duration (1-4 hours) to complete the oxygenation. This parameter transformation reduces total processing time from over 20 hours to approximately 5-8 hours while maintaining film performance.

Inventive Principle:
Principle #35Parameter changes

2Ease of manufacture

If manual handling is performed during oxygenation steps, then the process can be completed, but the high-value-added superconducting tapes are prone to damage and yield loss

Engineering Contradiction:
Improveprocess flexibilityVSAvoidyield rate
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent applies preliminary protective coating to the superconducting film before the oxygenation process. This protective layer prevents damage during handling and transport between processing steps, thereby maintaining high yield rates while allowing the oxygenation process to be performed effectively.

Inventive Principle:
Principle #10Preliminary action

3Manufacturing precision

If silver deposition is conducted at conventional temperatures, then the silver layer forms properly, but the overall manufacturing process time increases

Engineering Contradiction:
Improvesilver layer qualityVSAvoidmanufacturing throughput
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent implements continuous processing where the silver deposition is performed immediately after the reduced-time oxygenation step without intermediate cooling or handling. This continuous action maintains production flow and increases throughput while ensuring proper silver layer formation through controlled deposition parameters.

Inventive Principle:
Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces manufacturing time, maintains critical current performance, and enhances the microstructure and mechanical properties of the superconducting tapes, such as increased hardness and reduced porosity, thereby improving manufacturing efficiency and cost-effectiveness.

Implementation Method 1

Silver deposition is typically conducted by magnetron sputtering or evaporation

Methodology Applied
Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Implementation Method 2

oxygenation heat treatment in an oxygen ambient

Methodology Applied
Scientific EffectOxidation: Oxidation

Implementation Method 3

oxygenation heat treatment in an oxygen ambient

Methodology Applied
Scientific EffectHeat Treatment: Heat Treatment

Implementation Method 4

Electroplating, Electroless plating, lamination or other bonding techniques may be used to apply the copper stabilizer

Methodology Applied
Scientific EffectElectroplating: Electroplating

Data Source

PatentUS10453590B2Superconductor and method for superconductor manufacturing
Publication Date: 2019.10.22 UNIV HOUSTON SYST
  • US10453590B2 patent drawing
  • US10453590B2 patent drawing
  • US10453590B2 patent drawing

AI summary

Disclosed is a superconducting article comprising a silver overlayer consisting of no more than about 20% of grains over about 1 μm, having a minimum Vickers micro-hardness value of about 100, and a porosity of less than about 1%. A method of manufacturing a superconducting tape is disclosed as comprising, deposition of silver, oxygenation at about 400° C. for about 30 minutes, slitting, deposition of silver at a temperature of less than about 250° C., and application of copper.