Supercritical Fluid Bonding Semiconductor Components
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Solution Overview
Problem
Conventional methods for bonding and separating components in the semiconductor industry face challenges, such as thermal stress-induced fractures when processing components at temperatures higher than 500°C, and mechanical or chemical separation methods can cause deformation or fracture, especially when dealing with components made of different materials or materials like plastics.
Innovation Solution
A method using a supercritical fluid at temperatures of 40-400°C and pressures of 1,500-100,000 psi to bond or separate components, with the fluid selected from carbon dioxide, tetrafluoromethane, argon, nitrogen, organic solvents, or hydrocarbons, and optionally doped with elements like hydrogen, nitrogen, or halogens, to form or dissolve bonds without causing deformation or fracture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional bonding method using temperature higher than 500°C is applied, then covalent bonds form between bonding portions, but thermal stress causes fracture of composite when components are made of different materials
Solution Approach 1:
The patent changes the temperature parameter from conventional high temperature (>500°C) to lower temperature (40-400°C) by using supercritical fluid as the bonding medium. This parameter change allows bonding to occur without generating excessive thermal stress that would cause fracture in composite structures with different materials.
Solution Approach 2:
The patent introduces supercritical fluid as an intermediary medium between the bonding portions of components. This intermediary enables bond formation at lower temperatures by facilitating atomic diffusion and bond creation without requiring direct high-temperature contact between components, thereby preventing thermal stress-induced fracture.
2Strength
If conventional bonding method using temperature higher than 500°C is applied, then covalent bonds form between bonding portions, but high temperature is not suitable for processing components made of certain materials such as plastics
Solution Approach 1:
The patent changes the temperature parameter from conventional high temperature (>500°C) to lower temperature (40-400°C) by using supercritical fluid as the bonding medium. This parameter change expands material compatibility to include heat-sensitive materials like plastics that cannot be processed at conventional bonding temperatures.
3Ease of operation
If mechanical strength or chemical reaction is used to separate components, then components can be separated from composite, but deformation or fracture of components occurs
Solution Approach 1:
The patent uses supercritical fluid as an intermediary medium for separation, which dissolves or weakens the bonding between components without applying mechanical force or harsh chemical reactions. This allows components to be separated from the composite while maintaining their structural integrity and avoiding deformation or fracture.
Solution Approach 2:
The patent replaces mechanical separation methods (which cause deformation) with a chemical/supercritical fluid-based separation method. The supercritical fluid selectively interacts with the bonding interface, enabling separation without mechanical stress that would damage the components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables bonding and separation of components at lower temperatures, reducing thermal stress and preventing fractures, while minimizing defects, and is suitable for materials that cannot be processed at high temperatures, allowing for the creation of composites with fewer defects and efficient separation without deformation.
Implementation Method 1
A supercritical fluid is then introduced into the cavity with a temperature of 40-400° C. and a pressure of 1,500-100,000 psi. A pressure of 4-100,000 psi is applied on both the first and second components to assure that the bonding portion of the first component bond to the bonding portion of the second component.
Implementation Method 2
A supercritical fluid is then introduced into the cavity with a temperature of 40-400° C. and a pressure of 1,500-100,000 psi. Accordingly, the connecting layer between the first and the second components can be dissolved by the introduced supercritical fluid, resulting in the separation of the first and second components.
Data Source
AI summary
A method for bonding a first component to a second component includes placing the first and second components in a cavity. Each of the first and second components has a bonding portion, and the bonding portion of the first component faces the bonding portion of the second component. A supercritical fluid is then introduced into the cavity with a temperature of 40-400° C. and a pressure of 1,500-100,000 psi, and a pressure of 4-100,000 psi is applied on both the first and second components, assuring the bonding portion of the first component bond to the bonding portion of the second component. Moreover, a method for separating a first component from a second component includes placing a composite in a cavity. The composite includes the first component, the second component and a connecting layer by which the first component joins to the second component. The supercritical is then introduced into the cavity.