Supercritical Substrate Chamber Flow Control to Prevent Vortices

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Solution Overview

Problem

Existing substrate treating apparatuses using supercritical fluids face challenges with non-uniform fluid flow on substrates, leading to vortex formation and issues with chemical liquid concentration and moisture residual in the treating chamber.

Innovation Solution

A substrate treating apparatus is designed to control the flow of treating fluid before it reaches a supercritical state by adjusting the supply and exhaust of the fluid, using a controller to manage the flow rates and pressures, and incorporating features like a bypass line and orifice to ensure uniform fluid distribution and efficient moisture removal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If treating fluid is injected into the treating space to perform supercritical treating, then the substrate can be treated with supercritical fluid, but non-uniform flow occurs on the substrate and vortex forms in partial regions

Engineering Contradiction:
Improvetreating effectivenessVSAvoidflow uniformity
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The treating space is divided into multiple regions with different pressure zones. The pressure increasing step is segmented into stages: first increasing pressure at the bottom of the substrate, then increasing pressure at the top, creating a controlled pressure gradient that prevents vortex formation while maintaining effective treatment

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Pressure is increased in a predetermined sequence before the substrate is fully exposed to supercritical fluid. The bottom pressure is increased first, followed by top pressure increase, preparing the fluid distribution pattern in advance to avoid non-uniform flow and vortex during the main treatment phase

Inventive Principle:
Principle #10Preliminary action

2Reliability

If pressure is increased to reach supercritical state, then treating fluid achieves supercritical properties for effective treatment, but chemical liquid concentration and moisture concentration inside the chamber increase

Engineering Contradiction:
Improvetreating effectivenessVSAvoidchemical liquid concentration and moisture concentration
Core Design Contradiction:
ReliabilityVSQuantity of substance

Solution Approach 1:

The exhaust valve maintains continuous operation throughout the pressure increasing steps to continuously remove excess chemical liquid and moisture from the chamber. This continuous exhaust action ensures that while pressure builds to supercritical levels, the concentration of harmful substances remains controlled and does not accumulate

Inventive Principle:
Principle #20Continuity of useful action

Solution Approach 2:

The controller monitors pressure levels and adjusts the exhaust valve operation accordingly. When pressure reaches predetermined thresholds, the controller regulates the exhaust rate to maintain optimal balance between supercritical fluid generation and removal of excess chemical liquid and moisture, creating a feedback-controlled concentration management system

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus effectively controls the fluid flow and chemical liquid concentration, preventing vortex formation and ensuring efficient drying of substrates, thereby enhancing the replacement force in fine patterns and preventing drying failures.

Implementation Method 1

increasing a pressure in the treating space from a pressure lower than a critical pressure of the treating fluid to a treating pressure higher than the critical pressure

Methodology Applied
Scientific EffectSupercritical fluid phase transition: Phase Change

Data Source

PatentUS12334330B2Substrate treating apparatus
Publication Date: 2025.06.17 SYSTEM ENGINEERING MEGA SOLUTION CO LTD
  • US12334330B2 patent drawing
  • US12334330B2 patent drawing
  • US12334330B2 patent drawing

AI summary

An apparatus for treating a substrate using a treating fluid in a supercritical state is provided. In a pressure increasing step of increasing a pressure in the treating space from a pressure lower than a critical pressure of the treating fluid to a treating pressure higher than the critical pressure, the apparatus controls a supply amount of the treating fluid supplied from a first supply port to control flow of the treating fluid supplied from the first supply port and then exhausted through an exhaust port.