Supercritical Substrate Chamber Layout for High-Throughput Drying
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Solution Overview
Problem
Current supercritical drying processes for semiconductor substrates have low throughput due to the large footprint of process chambers required to maintain high-pressure conditions, which affects the efficiency of substrate treatment.
Innovation Solution
A compact substrate treatment apparatus with a process chamber design that includes a housing with an entrance, a support member, and a door mechanism for high-pressure operations, allowing for efficient use of space and improved substrate throughput by using supercritical fluids for drying.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large process chamber is used to maintain high-pressure supercritical state, then the supercritical drying process can be performed effectively, but the footprint increases and substrate throughput decreases
Solution Approach 1:
The patent transitions from horizontal chamber expansion to vertical stacking of multiple process chambers. By arranging chambers in the vertical dimension rather than expanding horizontally, the system maintains adequate chamber volume for supercritical processing while reducing the overall footprint area, thereby resolving the contradiction between drying effectiveness and space efficiency
Solution Approach 2:
The system divides the processing into multiple separate process chambers that can be stacked vertically. Each chamber is optimized for specific processing steps, allowing the system to achieve the required supercritical conditions in each chamber while the overall compact vertical arrangement reduces the total footprint compared to a single large horizontal chamber
2Reliability
If a large process chamber is used to maintain high-pressure supercritical state, then the supercritical drying process can be performed effectively, but the substrate throughput decreases
Solution Approach 1:
By segmenting the processing into multiple independent chambers that can operate in parallel or sequence, the system increases substrate throughput. Each chamber can process substrates simultaneously or in rapid succession, maintaining effective supercritical drying while improving overall productivity compared to a single large chamber
Solution Approach 2:
The multi-chamber vertical stacking enables continuous substrate processing where substrates can be transferred between chambers in a continuous flow. This eliminates idle time between processing cycles and maintains continuous useful action, thereby increasing throughput while each chamber maintains the necessary conditions for effective supercritical drying
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus enables efficient high-pressure processing with reduced spatial requirements, enhancing substrate treatment efficiency and preventing pattern collapse during the drying process.
Implementation Method 1
a pressing member configured to apply a force to the door so as to close the housing during the high pressure process
Implementation Method 2
Supercritical fluids mean any substance being at a temperature and pressure above its critical point and having both the gas and liquid properties. Supercritical fluids are outstanding in diffusion ability, permeation ability, and dissolving other substrates, and have little surface tension.
Implementation Method 3
Supercritical fluids are outstanding in diffusion ability, permeation ability, and dissolving other substrates
Implementation Method 4
Supercritical fluids are outstanding in diffusion ability, permeation ability, and dissolving other substrates
Data Source
AI summary
Provided are an apparatus and method for treating a substrate. More particularly, an apparatus and method for treating a substrate through a supercritical process are provided. The apparatus includes: a housing having an entrance in a predetermined surface thereof and providing a space for performing a high pressure process; a support member disposed in the housing to support a substrate; a door for opening and closing the entrance; and a pressing member configured to apply a force to the door so as to close the housing during the high pressure process.