Supercritical Substrate Drying Alignment for Particle Defect Reduction
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Solution Overview
Problem
In the process of forming fine photoresist patterns using extreme ultraviolet (EUV) lithography, there are issues with particle defects on substrates during semiconductor device production, which affect the uniformity and quality of the patterns.
Innovation Solution
A substrate processing apparatus and method that includes a processing container, a substrate support, a fluid supplier for supercritical fluids, a shower head assembly, and laser portions for alignment correction, along with a gyro sensor for measuring inclinations, to ensure precise alignment and positioning of the substrate and processing components, thereby improving processing uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If supercritical fluid processing is used to form fine photoresist patterns, then pattern resolution is improved, but particle defects occur on the substrate
Solution Approach 1:
The patent changes the physical state parameters of the processing fluid by transitioning from liquid to supercritical state, and controls temperature and pressure parameters during processing to eliminate particle defects while maintaining fine pattern formation capability
Solution Approach 2:
The patent utilizes the phase transition of carbon dioxide from liquid to supercritical state, and subsequently to gas state, to achieve uniform distribution and elimination of processing residues, preventing particle defects on the substrate
2Manufacturing precision
If alignment measurement is performed to improve positioning accuracy, then manufacturing precision is improved, but device complexity increases due to multiple laser portions and sensors
Solution Approach 1:
The jig is designed to serve multiple functions: it holds the substrate, supports the gyro sensor for inclination measurement, and mounts the first and second laser portions for alignment measurement, reducing the need for separate positioning devices
Solution Approach 2:
The patent combines multiple measurement functions (inclination measurement by gyro sensor, horizontal alignment by first laser portion, vertical alignment by second laser portion) into an integrated alignment system mounted on a single jig
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the uniformity of substrate processing by reducing particle defects and improving the alignment and positioning of components, leading to higher quality photoresist patterns and reduced occurrence of leaning or water spots during the drying process.
Implementation Method 1
a gyro sensor configured to be mounted on the jig and to measure an inclination of the substrate and a lower body of the processing container
Implementation Method 2
each of the first laser portion and the second laser portion is configured to emit laser beams toward one of the processing container and the shower head assembly at at least three different points on the jig
Implementation Method 3
a fluid supplier configured to supply a processing fluid in a supercritical state to the processing space
Data Source
AI summary
Provided is a substrate processing apparatus including a processing container having a processing space, a substrate support configured to support a substrate, a fluid supplier configured to supply a processing fluid in a supercritical state to the processing space, a shower head assembly configured to diffuse the processing fluid, a first laser portion configured to measure a horizontal alignment between the processing container and the shower head assembly, a second laser portion configured to measure a vertical alignment between the processing container and the shower head assembly, and a controller configured to correct the position of one of the substrate, the shower head assembly, and the processing container, based on the measured horizontal and vertical alignments, wherein the first and second laser portions are configured to be positioned within the processing container and to move above the substrate.