Supercritical Fluid Drying Chamber With Adjustable Volume
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Solution Overview
Problem
Current drying processes for semiconductor substrates using nitrogen or isopropyl alcohol (IPA) can damage fine pattern structures due to surface tension, and traditional supercritical fluid drying methods with closed chambers are inefficient and wasteful due to large inner spaces.
Innovation Solution
A drying apparatus and method utilizing supercritical fluid with a vertically movable upper cover and base to form a minimized closed chamber, incorporating a fluid disturbance plate and strategically placed through holes for efficient fluid distribution and discharge, reducing the inner space and supercritical fluid usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional closed chamber drying apparatus is used with large inner space, then substrate can be dried effectively, but supercritical fluid usage increases and process efficiency decreases
Solution Approach 1:
The chamber volume is made dynamically adjustable through vertically movable base and upper cover that can change position according to substrate thickness. This dynamic adjustment optimizes the chamber size to match the actual drying needs, preventing excessive supercritical fluid consumption while maintaining effective drying coverage for substrates of varying dimensions.
Solution Approach 2:
The apparatus changes the physical state parameters of the drying environment by transitioning from atmospheric pressure state to supercritical state through controlled pressure and temperature changes. The first fluid supply tube introduces supercritical fluid to raise pressure, transforming the drying environment parameters to achieve effective drying with reduced fluid consumption.
2Device complexity
If supercritical fluid is supplied directly from above substrate, then drying process is simplified, but fine pattern structures may be damaged due to fluid impact
Solution Approach 1:
The fluid supply process is segmented into two distinct stages: first, atmospheric pressure supercritical fluid is supplied from above to replace IPA without direct substrate contact; second, side-wall fluid supply tubes provide gentle supercritical fluid flow along the substrate edges. This segmentation prevents direct high-velocity impact on fine patterns while maintaining drying effectiveness.
Solution Approach 2:
Atmospheric pressure supercritical fluid acts as an intermediary medium in the first stage, replacing IPA on the substrate surface without causing damage. This intermediary fluid transfer mechanism allows the harmful IPA to be removed while protecting sensitive substrate patterns from direct mechanical impact.
3Device complexity
If base and upper cover are fixed position, then apparatus structure is simpler, but chamber volume cannot be optimized for different substrate sizes
Solution Approach 1:
The base and upper cover are designed with vertical mobility rather than fixed positions, allowing the chamber volume to be dynamically adjusted according to substrate dimensions. This dynamic configuration enables optimization of supercritical fluid consumption by matching chamber size to actual substrate requirements, preventing waste from excessive chamber volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution minimizes supercritical fluid usage, prevents damage to substrate patterns, and enhances the efficiency of the drying process by optimizing fluid circulation and distribution within the closed chamber.
Implementation Method 1
a drying process based on supercritical fluid with zero surface tension is used, covering the substrate surface with IPA, and replacing the IPA on the substrate surface by the supercritical fluid
Implementation Method 2
configured to supply supercritical fluid to the interior of the closed chamber, to make the closed chamber reach a supercritical state from an atmospheric pressure state
Implementation Method 3
the volatilization of the supercritical fluid with zero surface tension will not cause the fine pattern structures on the substrate to collapse
Data Source
AI summary
A drying apparatus is based on supercritical fluid. The drying apparatus includes: an upper cover; a base, arranged below the upper cover and the base and the upper cover; a substrate tray, arranged on the base; a first fluid supply tube, arranged on the top wall of the upper cover; a fluid disturbance plate, arranged below the first fluid supply tube; a second fluid supply tube, arranged on a first side wall of the upper cover; and a fluid discharge tube, arranged on a second side wall of the upper cover. The inner space of the closed chamber can be minimized by using the drying apparatus, thereby saving the usage amount of the supercritical fluid, and reducing the usage costs.