Supercritical Drying Density Correction for Substrate Processing

The patent applies parameter changes by introducing temperature and pressure as correction parameters to improve density measurement accuracy. The density detector measures density under actual drying conditions (temperature and pressure), and the controller calculates corrected density values by applying temperature and pressure correction coefficients. This resolves the contradiction by transforming the measurement from a simple density comparison to a multi-parameter corrected measurement, achieving both high precision termination time determination and reliable drying process control.

The patent replaces complex physical correction mechanisms with computational processing. Instead of using additional mechanical sensors or complex measurement systems, the invention uses the existing density detector combined with temperature and pressure detection, then applies mathematical correction through the controller. The controller calculates corrected density by applying correction coefficients to the measured density based on detected temperature and pressure values. This substitution of mechanical complexity with computational processing achieves high manufacturing precision while maintaining relatively simple device structure.

The patent applies preliminary action by pre-storing temperature and pressure correction coefficient tables in the controller before the actual drying process. These correction coefficients are determined in advance through experiments or calculations and stored for quick retrieval. During the drying process, the controller simply looks up the appropriate correction coefficients based on detected temperature and pressure values and applies them to the measured density. This preliminary preparation eliminates the need for complex real-time calculations, minimizing information loss while maintaining high processing efficiency.