Supercritical Drying Apparatus With Dual Flow Lines
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Solution Overview
Problem
The existing drying processes for semiconductor substrates, particularly those with fine circuit patterns, face challenges in removing water without causing pattern collapse due to the use of organic solvents, and the recent shift to supercritical drying aims to address these limitations but requires efficient fluid supply and discharge methods to prevent substrate damage and enhance process efficiency.
Innovation Solution
The proposed apparatus and method involve a substrate drying system that utilizes supercritical fluids, specifically carbon dioxide, with controlled flow rates and pressures to prevent substrate damage and optimize the drying process by supplying and discharging the fluid through multiple parallel lines with adjustable flow control valves, allowing for efficient and rapid processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a supercritical fluid is supplied quickly to shorten drying time, then productivity is improved, but substrate breakage occurs due to particle generation and pressure shock
Solution Approach 1:
The supply line is divided into multiple segments (first supply line and second supply line) that can operate independently. The first supply line supplies supercritical fluid at a lower flow rate to prevent substrate damage, while the second supply line supplies at a higher flow rate to shorten drying time. This segmentation allows the system to achieve both high productivity and substrate integrity by selectively activating different segments based on process requirements.
Solution Approach 2:
The system dynamically adjusts the flow rate of supercritical fluid supplied to the substrate by controlling the opening degrees of flow control valves in different supply lines. During initial stages, a lower flow rate is used to avoid substrate damage, while during later stages, a higher flow rate is used to accelerate drying. This dynamic adjustment resolves the contradiction between productivity and reliability.
2Device complexity
If a single supply line is used, then device complexity is reduced, but the ability to control flow rates and prevent substrate damage is limited
Solution Approach 1:
Instead of using a single supply line, the system is segmented into multiple supply lines (first and second supply lines) with independent flow control. This segmentation increases device complexity but enables precise control over fluid supply rates, allowing the system to protect substrates during critical phases while maintaining operational efficiency. The additional complexity is justified by the significant improvement in substrate protection capability.
3Manufacturing precision
If organic solvent is used to replace pure water, then manufacturing precision is improved by preventing pattern collapse, but loss of time increases due to slow substitution process
Solution Approach 1:
The system changes the physical parameters of the drying fluid by using supercritical carbon dioxide instead of traditional organic solvents like isopropyl alcohol. Supercritical CO2 has unique properties (gas-like diffusivity and liquid-like density) that enable rapid penetration and displacement of organic solvents from substrates. This parameter change reduces the solvent substitution time significantly while maintaining the manufacturing precision benefits of using organic solvents for pattern protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents substrate breakage, shortens the drying process time, and improves efficiency by using supercritical fluids with controlled flow rates and pressures, ensuring thorough drying without damaging the substrate and enhancing the overall process efficiency.
Implementation Method 1
a fluid supply member including a supply line for supplying a process fluid of a supercritical state to the housing
Implementation Method 2
a first flow control valve that controls the process fluid to flow at a first supply flow rate. The second supply line may include a second flow control valve that controls the process fluid to flow at a second supply flow rate
Data Source
AI summary
Provided is an apparatus and method for drying a substrate. The apparatus includes a housing, a substrate support member, a fluid supply member, and a discharge member. The housing provides a space in which a drying process is performed. The substrate support member is provided in the housing to support the substrate. The fluid supply member includes a supply line for supplying a process fluid of a supercritical state to the housing. The discharge member includes a discharge line for discharging the process fluid from the housing. Here, the supply line includes a first supply line provided to supply the process fluid to the housing at a first supply flow rate, and a second supply line provided to supply the process fluid to the housing at a second supply flow rate.