Supercritical Substrate Drying with Dual-Flow Uniformity Control
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Solution Overview
Problem
Existing substrate drying methods using supercritical fluids face challenges in uniformly distributing the fluid flow, leading to non-uniform particle distribution and potential pattern collapse during the drying process of substrates with fine patterns.
Innovation Solution
A substrate processing apparatus and method utilizing a dual-flow mode system with symmetrical discharge and drain units, controlled by a flow control device, to uniformly distribute supercritical fluid flow and minimize particle accumulation on the substrate surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single flow mode is used for supercritical fluid drying, then the device structure is simple, but the fluid flow distribution is non-uniform causing particle accumulation and pattern collapse
Solution Approach 1:
The patent implements a dynamic flow control system that switches between a first flow mode (with first discharge and drain units) and a second flow mode (with second discharge and drain units). This dynamic switching enables uniform fluid flow distribution across the substrate surface during drying, preventing particle accumulation and pattern collapse while maintaining manageable device complexity through systematic unit configuration.
2Productivity
If supercritical fluid is used for drying, then drying effectiveness is improved, but particle distribution becomes non-uniform leading to pattern collapse
Solution Approach 1:
The patent segments the fluid discharge and drainage system into multiple independent units: first discharge units, first drain units, second discharge units, and second drain units. Each unit is positioned to target specific regions of the substrate, enabling precise control over fluid flow distribution. This segmentation ensures uniform particle distribution and prevents pattern collapse while maintaining high drying efficiency through parallel processing capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The dual-flow mode system effectively reduces particle accumulation and suppresses pattern collapse by uniformly distributing the supercritical fluid flow, enhancing the drying process efficiency and substrate quality.
Implementation Method 1
drying a substrate, which has a liquid adhering to a surface thereof, by using a processing fluid in a supercritical state
Data Source
AI summary
A substrate processing method of drying a substrate by using a processing fluid in a supercritical state is performed by a substrate processing apparatus. The substrate processing apparatus includes a fluid discharge unit, a supply line, a fluid drain unit, a drain line and a flow control device. The substrate processing method includes: flowing the processing fluid from the fluid discharge unit to the fluid drain unit such that the processing fluid flows along a surface of the substrate. The flowing of the processing fluid includes flowing the processing fluid in a first flow mode and flowing the processing fluid in a second flow mode. Between the first flow mode and the second flow mode, a flow direction distribution of the processing fluid is different, and a switchover between the first flow mode and the second flow mode is performed by the flow control device.