Supercritical Fluid Drying Apparatus for Semiconductor Substrate Pattern Collapse Prevention
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Solution Overview
Problem
Current drying processes in semiconductor manufacturing, particularly those using organic solvents, can cause pattern collapse in substrates with fine circuit patterns, leading to defects and yield reduction, necessitating a more effective drying method.
Innovation Solution
A substrate treating apparatus utilizing a supercritical fluid, such as carbon dioxide, is developed to efficiently dry substrates by preventing the introduction of non-supercritical fluids into the processing chamber, ensuring precise control over the drying process and preventing pattern damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If an organic solvent drying process is used, then the drying process can be performed, but pattern collapse occurs in fine circuit patterns
Solution Approach 1:
The patent changes the physical parameters of the drying fluid by using supercritical carbon dioxide instead of organic solvents. The supercritical fluid is maintained at temperatures above 31.1°C and pressures above 73 atm, which gives it unique properties (density similar to liquid, viscosity similar to gas) that enable effective drying without surface tension that causes pattern collapse
Solution Approach 2:
The patent utilizes the phase transition properties of carbon dioxide. The CO2 is supplied in a supercritical state for drying, then undergoes phase transition to gas state for easy removal from the substrate. This phase change occurs without leaving residual liquid, preventing pattern collapse while maintaining drying efficiency
2Ease of operation
If a vent tube is branched from the supply tube to discharge remaining supercritical fluid, then fluid control is improved, but device complexity increases
Solution Approach 1:
The patent segments the fluid supply system by branching the vent tube from the main supply tube. This allows independent control of fluid discharge pathways - one path for supplying supercritical CO2 to the substrate, and another path for venting remaining fluid. The segmentation enables precise control of fluid flow without requiring complex centralized control mechanisms
Solution Approach 2:
The vent tube acts as an intermediary pathway that mediates the disposal of remaining supercritical fluid. By providing this separate intermediate channel, the system can control fluid flow more easily without directly modifying the main supply mechanism, thus improving ease of operation while adding minimal complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of supercritical fluids enhances drying efficiency, prevents pattern collapse, and maintains substrate integrity by avoiding the surface tension issues associated with traditional organic solvent drying methods, thereby improving the yield and performance of semiconductor devices.
Implementation Method 1
a substrate treating apparatus that is capable of efficiently performing a drying process by using a supercritical fluid
Implementation Method 2
The present invention also provides a substrate treating apparatus that prevents a fluid except for a supercritical fluid from being supplied into a housing
Data Source
AI summary
Provided is an apparatus for treating a substrate using a supercritical fluid. The substrate treating apparatus includes a housing, a support member disposed within the housing to support the substrate, a supercritical fluid supply unit in which the supercritical fluid is stored, a supply tube connecting the supercritical fluid supply unit to the housing to adjust an amount of supercritical fluid supplied from the supercritical fluid supply unit into the housing, and a vent tube branched from the supply tube to discharge the supercritical fluid remaining in the supply tube. A switching valve opening or closing the vent tube is disposed in the vent tube.