Supercritical Fluid Supply Control for Responsive Substrate Processing
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Solution Overview
Problem
Existing substrate processing apparatuses face challenges in effectively controlling the flow rate of supercritical fluids, which affects the efficiency and responsiveness of the processing operations.
Innovation Solution
The apparatus includes a fluid supply line with a pump, a heater, and flow rate adjusters, along with pressure measurement sections to control the flow rate of the supercritical fluid based on measured pressures, thereby improving responsiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a processing fluid supply is controlled based on an output from a pressure sensor provided on the downstream side of the processing container, then the flow rate of supercritical fluid can be controlled, but the responsiveness of the control is insufficient
Solution Approach 1:
The patent places pressure sensors on the upstream side of the processing container, before the fluid enters the processing space. This allows the control system to detect pressure changes and adjust the flow rate in advance, before the fluid actually enters the processing container, thereby improving control responsiveness while maintaining accuracy
Solution Approach 2:
The patent introduces a control system that uses upstream pressure measurements as an intermediary indicator to predict and control the actual flow rate into the processing container. By measuring pressure at an upstream location and using this information to adjust the flow, the system achieves better responsiveness without sacrificing control accuracy
2Productivity
If multiple dry units are operated simultaneously, then productivity increases, but the evenness of supply flow rates among the dry units deteriorates
Solution Approach 1:
The patent divides the fluid supply system into separate branched lines, with each dry unit having its own dedicated supply line equipped with independent flow rate adjusters and pressure sensors. This segmentation allows each dry unit to be controlled independently, ensuring uniform flow rates even when multiple units operate simultaneously, thereby maintaining evenness while increasing overall productivity
Solution Approach 2:
The patent implements local flow rate control by providing each dry unit with its own flow rate adjuster and pressure sensor on its dedicated supply line. This localized control ensures that each unit receives the appropriate flow rate independently, maintaining uniformity across all units while enabling simultaneous operation of multiple dry units for increased productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the evenness of supply flow rates among multiple dry units and processes, improving the overall efficiency and responsiveness of the substrate processing operations.
Implementation Method 1
a heater provided in the fluid supply line at a location on a downstream side of the pump, the heater being configured to heat the processing fluid to generate the processing fluid in the supercritical state
Implementation Method 2
a pump provided in the fluid supply line; a heater provided in the fluid supply line at a location on a downstream side of the pump, the heater being configured to heat the processing fluid to generate the processing fluid in the supercritical state
Data Source
AI summary
A substrate processing apparatus includes a processing container; and a processing fluid supply configured to supply a processing fluid in a supercritical state into the processing container. The processing fluid supply includes a fluid supply line connected to a fluid supply source and the processing container; a pump; a heater on a downstream side of the pump and configured to heat the processing fluid to generate the processing fluid in the supercritical state; a first flow rate adjuster between the pump and the heater; a first pressure measurement section between the first flow rate adjuster and the heater; a second pressure measurement section between the pump and the first flow rate adjuster; and a controller configured to control the second flow rate adjuster based on first and second pressures of the processing fluid in a liquid state measured by the first and second pressure measurement sections.