Supercritical Fluid Shower Head Layout for Uniform Substrate Processing

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Solution Overview

Problem

Existing substrate processing methods using supercritical fluids face challenges in achieving uniformity and preventing particle defects during the formation of fine photoresist patterns in semiconductor devices.

Innovation Solution

A substrate processing apparatus and method that includes a processing container with a substrate support, a fluid supply device, and a shower head assembly with distinct diameters, allowing for the diffusion of processing fluids in a supercritical state while forming an inclined flow path to reduce hydraulic pressure and impact on the substrate, thereby improving processing uniformity and reducing defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a single shower head is used to supply supercritical processing fluid, then the device structure is simple, but the processing uniformity across the substrate is poor

Engineering Contradiction:
Improveprocessing uniformityVSAvoidshower head structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The single shower head is divided into multiple shower heads (first shower head and second shower head) with different diameters. Each shower head supplies processing fluid to different regions of the substrate, enabling region-specific control of fluid distribution and improving overall processing uniformity across the substrate surface.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different shower heads with different diameters are positioned at different locations to provide locally optimized fluid supply. The first shower head with larger diameter supplies fluid to the central region, while the second shower head with smaller diameter supplies fluid to the peripheral region, matching the local requirements of each substrate area.

Inventive Principle:
Principle #3Local quality

2Reliability

If high flow rate processing fluid is supplied to ensure adequate coverage, then the processing effectiveness is improved, but particle defects increase due to hydraulic pressure and impact on the substrate

Engineering Contradiction:
Improveprocessing effectivenessVSAvoidparticle defects
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The high flow rate fluid supply is segmented across multiple shower heads positioned at different locations and heights. This distributes the hydraulic pressure across multiple entry points rather than concentrating it in a single location, reducing the impact force on the substrate while maintaining adequate fluid coverage.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The shower heads are arranged in a vertical dimension at different heights above the substrate. This vertical arrangement allows the processing fluid to be supplied from multiple elevation levels, creating a more distributed and gentler fluid impact pattern that reduces particle defects while maintaining processing effectiveness.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances substrate processing uniformity and reduces particle defects by dispersing the processing fluid in a controlled manner, ensuring consistent and effective treatment of substrates without damaging the formed patterns.

Implementation Method 1

a shower head assembly configured to diffuse the processing fluid supplied from the fluid supply device into the processing space

Methodology Applied
Scientific EffectDiffusion: Diffusion

Implementation Method 2

a fluid supply device configured to supply a processing fluid in a supercritical state to the processing space

Methodology Applied
Scientific EffectSupercritical fluid: Supercritical Fluid

Data Source

PatentUS20250387810A1Substrate processing apparatus and substrate processing method
Publication Date: 2025.12.25 SAMSUNG ELECTRONICS CO LTD
  • US20250387810A1 patent drawing
  • US20250387810A1 patent drawing
  • US20250387810A1 patent drawing

AI summary

A substrate processing apparatus including a processing container including a processing space, a substrate support extending in a first direction and a second direction perpendicular to the second direction, and configured to support a substrate in the processing container, a fluid supply device configured to supply a processing fluid in a supercritical state to the processing space through a container supply pipe, and a shower head assembly configured to diffuse the processing fluid supplied from the fluid supply device into the processing space. The shower head assembly includes a first shower head having a first diameter, and a second shower head arranged between the first shower head and the substrate and having a second diameter. The processing container is separated from the shower head assembly in a third direction perpendicular to the first direction and the second direction, such that a flow path is formed between the processing container and the shower head assembly.