Atmospheric Supercritical Fluid Spray for Nanoscale Thin Films
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Solution Overview
Problem
Current methods for producing thin films of nanometer thickness, such as CVD and ALD, require vacuum environments, are costly, and inefficient, and restrict the use of substrates due to dehydration and decomposition, while atmospheric deposition methods cannot achieve nanoscale thickness.
Innovation Solution
A process involving the deposition of a mixture of a precursor and a supercritical fluid onto a substrate in an atmospheric environment, where the supercritical fluid is removed, and the precursor layer is solidified by plasma radicals to form a thin film of 1 nm to 100 nm thickness without the need for a purge step.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If vacuum deposition methods (CVD, ALD, MLD) are used to produce nanometer-thickness films, then film thickness precision is improved, but device complexity and cost increase due to vacuum equipment requirements
Solution Approach 1:
The invention changes the pressure parameter from vacuum to atmospheric pressure, fundamentally altering the deposition environment. This allows the use of simple spray nozzles instead of complex vacuum deposition equipment, while still achieving nanometer-thickness films through controlled precursor spray and plasma treatment
Solution Approach 2:
The invention replaces the mechanical vacuum system with a plasma-based chemical transformation system. Instead of using vacuum to achieve thin films, the process uses atmospheric pressure spray deposition followed by plasma-induced chemical reactions to form the desired nanometer-thickness film
2Manufacturing precision
If vacuum deposition methods are used, then film thickness precision is improved, but productivity decreases due to purge steps and hold steps
Solution Approach 1:
The invention extracts and eliminates the purge step and hold step from the deposition process. By using atmospheric pressure spray deposition followed by plasma treatment, the process achieves direct film formation without the time-consuming vacuum maintenance steps, significantly improving productivity
Solution Approach 2:
The invention implements continuous spray deposition followed by continuous plasma treatment, eliminating interruptions for vacuum pumping, purging, and holding. This continuous process maintains high deposition rates and improves overall productivity while preserving film thickness precision
3Manufacturing precision
If vacuum deposition methods are used, then film thickness precision is improved, but adaptability decreases due to substrate restrictions from dehydration and decomposition
Solution Approach 1:
The invention changes the environmental parameters from vacuum to atmospheric pressure and from low-temperature deposition to plasma-enhanced deposition. This allows the use of ambient air as the deposition medium, eliminating substrate restrictions caused by vacuum-induced dehydration and decomposition, and greatly improving substrate compatibility
Solution Approach 2:
The invention uses plasma radicals (strong oxidants) to facilitate the deposition process. The plasma treatment provides energetic radicals that enable precursor molecules to react and form thin films on substrates without requiring vacuum conditions, thereby removing substrate restrictions related to vacuum-induced damage
4Device complexity
If atmospheric deposition methods are used, then device complexity is reduced, but film thickness precision deteriorates (cannot achieve nanometer thickness)
Solution Approach 1:
The invention introduces plasma radicals as an intermediary to bridge the gap between simple atmospheric spray deposition and precise nanometer-thickness film formation. The plasma treatment acts as a mediating step that transforms the sprayed precursor into a controlled thin film with precise thickness, enabling nanometer precision without complex equipment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the production of thin films in an atmospheric environment, reducing costs and increasing efficiency by eliminating the need for vacuum equipment and substrate restrictions, while achieving the desired nanoscale thickness.
Implementation Method 1
depositing a mixture of a precursor and a supercritical fluid onto a substrate and removing molecules of the supercritical fluid
Implementation Method 2
The surface of the substrate is exposed to plasma radicals to transform the layer of the precursor to a solid film
Data Source
AI summary
Embodiments relate to forming a thin film of nanoscale thickness by depositing a mixture of a precursor and a supercritical fluid onto a surface of a substrate and removing the supercritical fluid from the surface of the substrate. The mixture is sprayed onto the surface by a spraying module. A layer of the precursor is formed on at least a portion of the surface. Molecules of the supercritical fluid is removed from the surface. The surface is exposed to plasma radical to transform the layer of the precursor into a solid thin film. In some embodiments, molecules of the precursor chemically bond with molecules of the supercritical fluid in the mixture. The molecules of the supercritical fluid can be decoupled from the molecules of the precursor before the layer of the precursor is formed.