Supercritical Substrate Treatment Chamber for Particle-Free Drying
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Solution Overview
Problem
In semiconductor processing, the reduction of design rules leads to issues like pattern collapse and bridge failure due to surface tension during liquid drying, and fine particles between patterns can cause failures, which existing supercritical fluid cleaning methods do not adequately address.
Innovation Solution
An apparatus and method utilizing a high pressure chamber with a fluid supply and exhaust system, including pre-vent units to manage process fluids, enhance treatment efficiency and reduce particle supply by using a supercritical fluid for substrate treatment, incorporating a controller to manage valve operations and create a Venturi effect for improved vacuum and particle removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a liquid treatment process is used to clean the substrate, then the cleaning effectiveness is improved, but pattern collapse and bridge failure occur due to surface tension during drying
Solution Approach 1:
The patent changes the physical state of the treatment liquid from liquid to supercritical fluid by adjusting temperature and pressure parameters. The supercritical fluid penetrates patterns more effectively for cleaning while avoiding surface tension issues during drying, thus resolving the contradiction between cleaning effectiveness and pattern integrity
Solution Approach 2:
The patent utilizes phase transition of the treatment liquid to supercritical state. By heating and pressurizing the liquid beyond its critical point, it transitions to a supercritical fluid that maintains cleaning effectiveness without the harmful surface tension effects during the drying process
2Object-generated harmful factors
If conventional supercritical fluid cleaning is used, then particle removal is improved, but fine particles deeply present between patterns remain
Solution Approach 1:
The patent modifies the physical parameters of the treatment liquid by converting it to a supercritical fluid state. This state allows the treatment medium to penetrate deeply between fine patterns more effectively, removing particles that conventional liquid methods cannot reach, thus improving manufacturing precision
3Reliability
If treatment liquid is supplied to the substrate in the liquid treating chamber, then cleaning is improved, but treatment liquid remains on the substrate causing defects
Solution Approach 1:
The patent changes the state of the treatment liquid to supercritical fluid, which eliminates surface tension. This allows the treatment medium to be removed from the substrate without leaving residual liquid, as the supercritical fluid can be evaporated or pumped away cleanly, improving both cleaning quality and preventing defects from residual liquid
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves treatment efficiency and reduces particle contamination on substrates during supercritical fluid processing, addressing the challenges of pattern collapse and bridge failure by effectively managing fluid dynamics and vacuum conditions.
Implementation Method 1
a pre-vent unit to vent a process fluid remaining inside a supply line
Implementation Method 2
The fluid supply unit includes a supply line to connect the high pressure chamber to the fluid supply source
Implementation Method 3
a high pressure chamber to remove the treatment liquid from the substrate using the supercritical fluid after the liquid treatment
Implementation Method 4
a high pressure chamber to remove the treatment liquid from the substrate using the supercritical fluid
Implementation Method 5
incorporating a controller to manage valve operations and create a Venturi effect for improved vacuum and particle removal
Data Source
AI summary
An apparatus for treating a substrate is provided. The apparatus for treating the substrate includes a high pressure chamber to provide a treatment space to perform a process of treating the substrate using a process fluid, a fluid supply source to provide the process fluid to the high pressure chamber, a fluid supply unit to supply the process fluid to the treatment space of the high pressure chamber, an exhaust unit to exhaust the process fluid in the high pressure chamber, and a pre-vent unit to vent a process fluid remaining inside a supply line.